7027S25PF8

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Mfr.Part #
7027S25PF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 512KBIT PARALLEL 100TQFP
Stock
19,758
In Stock :
19,758

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
JESD-609 Code :
e0
Word Size :
16b
ECCN Code :
EAR99
I/O Type :
COMMON
Write Cycle Time - Word, Page :
25ns
Operating Supply Voltage :
5V
Power Supplies :
5V
Density :
512 kb
Lead Free :
Contains Lead
Mount :
Surface Mount
Width :
14mm
Additional Feature :
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE
Published :
2009
Min Supply Voltage :
4.5V
Address Bus Width :
15b
Memory Size :
64KB
Memory Type :
RAM, SDR, SRAM
Factory Lead Time :
7 Weeks
Series :
--
Number of Pins :
100
Nominal Supply Current :
305mA
Max Supply Voltage :
5.5V
Terminal Pitch :
0.5mm
Length :
14mm
Base Part Number :
IDT7027
RoHS Status :
RoHS Compliant
Terminal Position :
QUAD
Pin Count :
100
Sync/Async :
ASYNCHRONOUS
Time@Peak Reflow Temperature-Max (s) :
20
Memory Format :
SRAM
Access Time :
25 ns
Voltage - Supply :
4.5 V ~ 5.5 V
Supply Voltage :
5V
Package / Case :
TQFP
Max Operating Temperature :
70°C
Min Operating Temperature :
0°C
Memory Interface :
Parallel
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Radiation Hardening :
No
Operating Temperature :
0°C ~ 70°C (TA)
Terminal Finish :
Tin/Lead (Sn85Pb15)
Standby Current-Max :
0.015A
Temperature Grade :
COMMERCIAL
Mounting Type :
Surface Mount
Peak Reflow Temperature (Cel) :
240
Pbfree Code :
No
Thickness :
1.4mm
Interface :
Parallel
Terminal Form :
Gull wing
Output Characteristics :
3-STATE
Packaging :
Tape and Reel
Number of Terminations :
100
Supplier Device Package :
100-TQFP (14x14)
Number of Ports :
2
Number of Functions :
1
Height Seated (Max) :
1.6mm
Datasheets
7027S25PF8
Introducing Memory Intersil (Renesas Electronics Corporation) 7027S25PF8 from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:100, Base Part Number:IDT7027, Package / Case:TQFP, Operating Temperature:0°C ~ 70°C (TA), Mounting Type:Surface Mount, Number of Terminations:100, 7027S25PF8 pinout, 7027S25PF8 datasheet PDF, 7027S25PF8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) 7027S25PF8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 7027S25PF8


Memory Intersil (Renesas Electronics Corporation) 7027S25PF8 Overview

The Memory Intersil (Renesas Electronics Corporation) 7027S25PF8 is a high-performance IC SRAM with a storage capacity of 512Kbit, crafted to meet the robust needs of modern digital systems. This device is housed in a compact 100TQFP package, which ensures a minimal footprint on system boards, optimizing space without compromising functionality. Renowned for its reliability and speed, the 7027S25PF8 offers an ideal solution for applications requiring rapid access to large volumes of temporary data, thus enhancing system efficiency and performance. The product's superior design and fabrication are synonymous with Intersil's commitment to providing cutting-edge technology and quality.

7027S25PF8 Features

This IC SRAM features a parallel interface, providing high-speed data transfer rates that are essential for performance-critical applications. It operates efficiently across a wide range of industrial temperatures, making it suitable for diverse operating environments. The 7027S25PF8 is also designed for low power consumption, aiding in the conservation of energy in intensive applications while maintaining optimal performance.

7027S25PF8 Applications

  • Networking Equipment: Utilized in routers and switches for buffering data, enhancing the speed and efficiency of data flow across the network.
  • Industrial Automation Systems: Employs its rapid data access capabilities to handle real-time processing demands, improving automation response times and reliability.
  • Telecommunications Infrastructure: Used in telecom systems for fast data buffering, supporting high-speed communications and reducing latency.
  • Automotive Electronics: Integral in advanced driver-assistance systems (ADAS) for processing and temporary data storage, ensuring swift decision-making processes.
  • Consumer Electronics: Serves in high-performance gaming consoles and computing devices, where quick access to temporary data is crucial for user experience.
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