70261S55PF8
- Mfr.Part #
- 70261S55PF8
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- TQFP
- Datasheet
- Download
- Description
- IC SRAM 256KBIT PARALLEL 100TQFP
- Stock
- 43,541
- In Stock :
- 43,541
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Memory
- Memory Size :
- 32kB
- Additional Feature :
- INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE
- Min Supply Voltage :
- 4.5V
- Number of Pins :
- 100
- Length :
- 14mm
- I/O Type :
- COMMON
- Organization :
- 16KX16
- Published :
- 2009
- Power Supplies :
- 5V
- Word Size :
- 16b
- Number of Terminations :
- 100
- Radiation Hardening :
- No
- Thickness :
- 1.4mm
- Mount :
- Surface Mount
- Width :
- 14mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Position :
- QUAD
- Min Operating Temperature :
- 0°C
- Max Operating Temperature :
- 70°C
- Lead Free :
- Contains Lead
- Interface :
- Parallel
- RoHS Status :
- RoHS Compliant
- Standby Current-Max :
- 0.015A
- Output Characteristics :
- 3-STATE
- Max Supply Voltage :
- 5.5V
- Number of Ports :
- 2
- Terminal Pitch :
- 0.5mm
- Pbfree Code :
- No
- Sync/Async :
- ASYNCHRONOUS
- Number of Functions :
- 1
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Peak Reflow Temperature (Cel) :
- 240
- Pin Count :
- 100
- Supply Voltage :
- 5V
- Density :
- 256 kb
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Address Bus Width :
- 28b
- Operating Supply Voltage :
- 5V
- ECCN Code :
- EAR99
- Package / Case :
- TQFP
- Access Time :
- 55 ns
- JESD-609 Code :
- e0
- Temperature Grade :
- COMMERCIAL
- Height Seated (Max) :
- 1.6mm
- Memory Type :
- RAM, SDR, SRAM
- Nominal Supply Current :
- 270mA
- Factory Lead Time :
- 7 Weeks
- Terminal Form :
- Gull wing
- Datasheets
- 70261S55PF8

Memory Intersil (Renesas Electronics Corporation) 70261S55PF8 Overview
The Memory Intersil (Renesas Electronics Corporation) 70261S55PF8 is a high-performance SRAM (Static Random-Access Memory) chip, designed to meet the rigorous demands of high-speed data acquisition and real-time processing. With a storage capacity of 256KBIT and housed in a 100TQFP (Thin Quad Flat Package), this IC offers a robust solution for applications requiring quick access to large volumes of data. Its parallel interface ensures rapid data transfer rates, making it an essential component in systems where speed and reliability are paramount. This product stands out in the marketplace not only for its technical specifications but also for its reliability and efficiency, making it highly attractive for B2B customers looking to integrate state-of-the-art memory components into their sophisticated electronic systems.
70261S55PF8 Features
The 70261S55PF8 IC boasts several features that make it a versatile and indispensable component in various applications. Key features include a large 256KBIT capacity, high-speed parallel interface, and compatibility with a wide range of operating voltages and temperatures. Its 100TQFP packaging is designed for efficient space utilization and enhanced thermal management, making it suitable for densely packed electronic assemblies.
70261S55PF8 Applications
- Embedded Systems: Utilized in controlling operations within embedded systems where quick memory access is crucial for real-time performance.
- Industrial Automation: Employs in automation equipment that requires rapid processing and storage of operational data to enhance precision and efficiency.
- Telecommunications: Critical in telecom infrastructure to manage vast amounts of data and support complex, high-speed communication protocols.
- Automotive Electronics: Supports advanced automotive systems, including infotainment and advanced driver-assistance systems (ADAS), where speed and data integrity are vital.
- Consumer Electronics: Integral to consumer electronics such as high-performance gaming consoles and smart home devices, improving user experience through faster data handling.
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