70261S25PF8

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Mfr.Part #
70261S25PF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 256KBIT PARALLEL 100TQFP
Stock
24,248
In Stock :
24,248

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Packaging :
Tape and Reel (TR)
Organization :
16KX16
Voltage - Supply :
4.5 V ~ 5.5 V
Output Characteristics :
3-STATE
Max Operating Temperature :
70°C
Pbfree Code :
No
Mount :
Surface Mount
Standby Current-Max :
0.015A
Width :
14mm
I/O Type :
COMMON
Operating Temperature :
0°C ~ 70°C (TA)
Mounting Type :
Surface Mount
Address Bus Width :
28b
Nominal Supply Current :
305mA
Max Supply Voltage :
5.5V
Time@Peak Reflow Temperature-Max (s) :
20
Word Size :
16b
Terminal Position :
QUAD
Memory Format :
SRAM
RoHS Status :
RoHS Compliant
Terminal Finish :
Tin/Lead (Sn85Pb15)
Package / Case :
TQFP
Factory Lead Time :
7 Weeks
Lead Free :
Contains Lead
JESD-609 Code :
e0
Power Supplies :
5V
Base Part Number :
IDT7026
Number of Functions :
1
Radiation Hardening :
No
Min Supply Voltage :
4.5V
Terminal Form :
Gull wing
Access Time :
25 ns
Interface :
Parallel
Thickness :
1.4mm
Min Operating Temperature :
0°C
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Write Cycle Time - Word, Page :
25ns
Additional Feature :
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE
Pin Count :
100
Height Seated (Max) :
1.6mm
Number of Ports :
2
Operating Supply Voltage :
5V
Series :
--
Sync/Async :
ASYNCHRONOUS
Memory Type :
RAM, SDR, SRAM
Peak Reflow Temperature (Cel) :
240
Supplier Device Package :
100-TQFP (14x14)
Supply Voltage :
5V
Published :
2009
Terminal Pitch :
0.5mm
Density :
256 kb
Temperature Grade :
COMMERCIAL
Memory Interface :
Parallel
Length :
14mm
Memory Size :
32kB
Number of Terminations :
100
ECCN Code :
EAR99
Number of Pins :
100
Datasheets
70261S25PF8
Introducing Memory Intersil (Renesas Electronics Corporation) 70261S25PF8 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C ~ 70°C (TA), Mounting Type:Surface Mount, Package / Case:TQFP, Base Part Number:IDT7026, Number of Terminations:100, Number of Pins:100, 70261S25PF8 pinout, 70261S25PF8 datasheet PDF, 70261S25PF8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70261S25PF8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70261S25PF8


Memory Intersil (Renesas Electronics Corporation) 70261S25PF8 Overview

The Memory Intersil (Renesas Electronics Corporation) 70261S25PF8 IC is a highly efficient and reliable SRAM chip, featuring a 256 Kbit capacity with parallel interface encapsulated in a 100TQFP package. This IC is designed to meet the rigorous demands of high-performance data storage and retrieval systems which require low latency and high-speed data access. Its robust design and advanced manufacturing technology ensure optimal performance and durability, making it suitable for a wide range of industrial and commercial applications.

70261S25PF8 Features

The 70261S25PF8 SRAM offers several key features that make it an excellent choice for demanding applications. These include its high-speed access time, low power consumption, and a parallel interface that enhances data transfer rates. The compact 100TQFP package ensures that it can be integrated into systems with space constraints while providing enough functionality to manage intensive data tasks efficiently.

70261S25PF8 Applications

  • Telecommunications: Utilized in switches and routers for fast data buffering and high-speed packet processing.
  • Automotive electronics: Employs in control units and infotainment systems to provide reliable, quick access to data critical for vehicle operations.
  • Industrial automation: Used in PLCs for real-time processing and machine control where rapid data retrieval is crucial.
  • Medical devices: Applied in medical imaging systems where quick data access speeds are necessary for processing large volumes of imaging data efficiently.
  • Consumer electronics: Integrated into gaming consoles and high-performance PCs, enhancing user experience with faster load times and smoother operation.
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