7006L20PF
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- Mfr.Part #
- 7006L20PF
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- TQFP
- Datasheet
- Download
- Description
- IC SRAM 128KBIT PARALLEL 64TQFP
- Stock
- 42,526
- In Stock ：
- 42,526
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Memory
- Voltage - Supply :
- 4.5 V ~ 5.5 V
- Sync/Async :
- ASYNCHRONOUS
- Write Cycle Time - Word, Page :
- 20ns
- Power Supplies :
- 5V
- Memory Format :
- SRAM
- Mounting Type :
- Surface Mount
- Base Part Number :
- IDT7006
- Min Supply Voltage :
- 4.5V
- Organization :
- 16KX8
- Factory Lead Time :
- 7 Weeks
- Temperature Grade :
- Industrial
- Thickness :
- 1.4mm
- Output Characteristics :
- 3-STATE
- ECCN Code :
- EAR99
- JESD-609 Code :
- e0
- Supplier Device Package :
- 64-TQFP (14x14)
- Terminal Position :
- QUAD
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Nominal Supply Current :
- 320mA
- Terminal Form :
- Gull wing
- Published :
- 2008
- Word Size :
- 8B
- Number of Ports :
- 2
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Pin Count :
- 64
- Density :
- 128 kb
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Lead Free :
- Contains Lead
- Length :
- 14mm
- Radiation Hardening :
- No
- Number of Pins :
- 64
- Access Time :
- 20 ns
- Number of Terminations :
- 64
- Number of Functions :
- 1
- I/O Type :
- COMMON
- Width :
- 14mm
- Address Bus Width :
- 28b
- Operating Supply Voltage :
- 5V
- Min Operating Temperature :
- -40°C
- Standby Voltage-Min :
- 2V
- Operating Temperature :
- -40°C ~ 85°C (TA)
- Peak Reflow Temperature (Cel) :
- 240
- Packaging :
- Tray
- Max Supply Voltage :
- 5.5V
- Mount :
- Surface Mount
- Interface :
- Parallel
- Terminal Pitch :
- 0.8mm
- Additional Feature :
- INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
- Supply Voltage :
- 5V
- Memory Size :
- 16kB
- Memory Interface :
- Parallel
- RoHS Status :
- RoHS Compliant
- Standby Current-Max :
- 0.004A
- Memory Type :
- RAM, SDR, SRAM
- Max Operating Temperature :
- 85°C
- Height Seated (Max) :
- 1.6mm
- Series :
- --
- Pbfree Code :
- No
- Package / Case :
- TQFP
- Datasheets
- 7006L20PF
Memory Intersil (Renesas Electronics Corporation) 7006L20PF Overview
The Memory Intersil (Renesas Electronics Corporation) 7006L20PF is a high-performance IC SRAM designed to meet the demanding requirements of high-speed data processing and storage. This integrated circuit features a robust 128KBIT capacity structured in a parallel configuration, making it ideally suited for applications requiring fast access and high reliability. Housed in a compact 64TQFP package, it offers a perfect blend of form factor and functionality, ensuring optimal integration into a variety of system architectures. The inclusion of advanced manufacturing technology from Intersil (Renesas Electronics Corporation) enhances its performance stability and operational longevity, making it a top choice for B2B customers looking to bulk purchase reliable memory solutions.
7006L20PF Features
The 7006L20PF SRAM chip boasts several key features that make it a standout choice for system designers and engineers. These include its parallel interface, which allows for rapid data transfer rates and ease of integration into existing architectures. Additionally, its low power consumption makes it ideal for applications where efficiency is crucial. The 64TQFP packaging not only provides a compact solution but also offers excellent thermal performance, further enhancing the chip's reliability under varied operating conditions.
7006L20PF Applications
- Telecommunications Equipment: Utilized in routers and switches for buffering data, helping to manage the flow of information and maintain system integrity under high traffic conditions.
- Automotive Electronics: Acts as temporary data storage for advanced driver-assistance systems (ADAS), supporting real-time processing and decision-making.
- Industrial Automation: Facilitates process control by storing program variables and real-time data, enabling quick access and response in automated production lines.
- Consumer Electronics: Integrated into devices such as digital cameras and gaming consoles, where fast access to temporary data enhances user experience and device functionality.
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