7006L20PF
- Mfr.Part #
- 7006L20PF
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- TQFP
- Datasheet
- Download
- Description
- IC SRAM 128KBIT PARALLEL 64TQFP
- Stock
- 42,526
- In Stock :
- 42,526
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Memory
- Write Cycle Time - Word, Page :
- 20ns
- Sync/Async :
- ASYNCHRONOUS
- Output Characteristics :
- 3-STATE
- Memory Type :
- RAM, SDR, SRAM
- Lead Free :
- Contains Lead
- Max Operating Temperature :
- 85°C
- Memory Interface :
- Parallel
- Voltage - Supply :
- 4.5 V ~ 5.5 V
- Terminal Position :
- QUAD
- Terminal Form :
- Gull wing
- JESD-609 Code :
- e0
- Mounting Type :
- Surface Mount
- Memory Size :
- 16kB
- Min Operating Temperature :
- -40°C
- Organization :
- 16KX8
- Operating Temperature :
- -40°C ~ 85°C (TA)
- Terminal Pitch :
- 0.8mm
- Density :
- 128 kb
- Length :
- 14mm
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Memory Format :
- SRAM
- Base Part Number :
- IDT7006
- Standby Current-Max :
- 0.004A
- Height Seated (Max) :
- 1.6mm
- Temperature Grade :
- Industrial
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Additional Feature :
- INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
- Supplier Device Package :
- 64-TQFP (14x14)
- Interface :
- Parallel
- Thickness :
- 1.4mm
- Radiation Hardening :
- No
- Nominal Supply Current :
- 320mA
- Operating Supply Voltage :
- 5V
- Peak Reflow Temperature (Cel) :
- 240
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pin Count :
- 64
- Series :
- --
- Access Time :
- 20 ns
- Address Bus Width :
- 28b
- Power Supplies :
- 5V
- Factory Lead Time :
- 7 Weeks
- Packaging :
- Tray
- Number of Ports :
- 2
- RoHS Status :
- RoHS Compliant
- Published :
- 2008
- Supply Voltage :
- 5V
- Package / Case :
- TQFP
- I/O Type :
- COMMON
- Number of Functions :
- 1
- Number of Pins :
- 64
- ECCN Code :
- EAR99
- Word Size :
- 8B
- Number of Terminations :
- 64
- Min Supply Voltage :
- 4.5V
- Width :
- 14mm
- Pbfree Code :
- No
- Max Supply Voltage :
- 5.5V
- Mount :
- Surface Mount
- Standby Voltage-Min :
- 2V
- Datasheets
- 7006L20PF

Memory Intersil (Renesas Electronics Corporation) 7006L20PF Overview
The Memory Intersil (Renesas Electronics Corporation) 7006L20PF is a high-performance IC SRAM designed to meet the demanding requirements of high-speed data processing and storage. This integrated circuit features a robust 128KBIT capacity structured in a parallel configuration, making it ideally suited for applications requiring fast access and high reliability. Housed in a compact 64TQFP package, it offers a perfect blend of form factor and functionality, ensuring optimal integration into a variety of system architectures. The inclusion of advanced manufacturing technology from Intersil (Renesas Electronics Corporation) enhances its performance stability and operational longevity, making it a top choice for B2B customers looking to bulk purchase reliable memory solutions.
7006L20PF Features
The 7006L20PF SRAM chip boasts several key features that make it a standout choice for system designers and engineers. These include its parallel interface, which allows for rapid data transfer rates and ease of integration into existing architectures. Additionally, its low power consumption makes it ideal for applications where efficiency is crucial. The 64TQFP packaging not only provides a compact solution but also offers excellent thermal performance, further enhancing the chip's reliability under varied operating conditions.
7006L20PF Applications
- Telecommunications Equipment: Utilized in routers and switches for buffering data, helping to manage the flow of information and maintain system integrity under high traffic conditions.
- Automotive Electronics: Acts as temporary data storage for advanced driver-assistance systems (ADAS), supporting real-time processing and decision-making.
- Industrial Automation: Facilitates process control by storing program variables and real-time data, enabling quick access and response in automated production lines.
- Consumer Electronics: Integrated into devices such as digital cameras and gaming consoles, where fast access to temporary data enhances user experience and device functionality.
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