638-026-632-267
- Mfr.Part #
- 638-026-632-267
- Manufacturer
- EDAC Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN D-SUB HD RCPT 26P SLDR CUP
- Stock
- 5,870
- In Stock :
- 5,870
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- Manufacturer :
- EDAC Inc.
- Product Category :
- D-Sub Connector Assemblies
- Termination :
- Solder Cup
- Manufacturer :
- Siemens Building Technologies
- Connector Type :
- Receptacle, Female Sockets
- Base Product Number :
- 638-026
- Backset Spacing :
- -
- Ingress Protection :
- -
- Flange Feature :
- Mating Side, Female Screwlock (4-40)
- Contact Material :
- COPPER ALLOY
- Features :
- Board Lock, Shielded
- Contact Finish Thickness :
- 30.0µin (0.76µm)
- Subcategory :
- D-Sub Connectors
- Color :
- Black
- Series :
- 638
- Contact Finish :
- Gold
- Package :
- Tray
- Operating Temperature :
- -55°C ~ 125°C
- Current Rating (Amps) :
- 3A per Contact
- Brand :
- EDAC
- Contact Type :
- Signal
- Wire Gauge :
- -
- Dielectric Material :
- Polyester Thermoplastic
- Voltage Rating :
- -
- Number of Rows :
- 3
- Connector Style :
- D-Sub, High Density
- Product Category :
- D-Sub High Density Connectors
- Material Flammability Rating :
- UL94 V-0
- Contact Form :
- -
- Product Status :
- Active
- Mounting Type :
- Free Hanging (In-Line)
- Connection Type :
- Threaded
- Product Type :
- High Density D-Sub Connectors
- Shell Size, Connector Layout :
- 2 (DA, A) High Density
- Number of Positions :
- 26
- Shell Material, Finish :
- Steel, Tin Plated
- Datasheets
- 638-026-632-267

638 Series D-Sub, High Density Receptacle, Female Sockets 26-Position Signal Solder Cup 2 (DA, A) High Density Free Hanging (In-Line) Copper Alloy Gold Steel, Tin Plated
638-026-632-267 Overview
It comes in Receptacle, Female Sockets packaging.There is a mounting type of Free Hanging (In-Line) for this device.This product is part of the 638 Series.In this case, the device operates at -55°C ~ 125°C Operating Temperature.
638-026-632-267 Features
638 series
638-026-632-267 Applications
There are a lot of EDAC
638-026-632-267 D-Sub Connectors applications.
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
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