6116LA55DB

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Mfr.Part #
6116LA55DB
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
24-CDIP (0.600, 15.24mm)
Datasheet
Download
Description
IC SRAM 16KBIT PARALLEL 24CDIP
Stock
48,538
In Stock :
48,538

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Package / Case :
24-CDIP (0.600, 15.24mm)
Memory Format :
SRAM
Memory Interface :
Parallel
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Operating Temperature :
-55°C~125°C TA
Write Cycle Time - Word, Page :
55ns
Voltage - Supply :
4.5V~5.5V
Packaging :
Tray
Memory Type :
Volatile
Base Part Number :
IDT6116
Mounting Type :
Through Hole
Factory Lead Time :
15 Weeks
RoHS Status :
Non-RoHS Compliant
Memory Size :
16Kb 2K x 8
Datasheets
6116LA55DB
Introducing Memory Intersil (Renesas Electronics Corporation) 6116LA55DB from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:24-CDIP (0.600, 15.24mm), Operating Temperature:-55°C~125°C TA, Base Part Number:IDT6116, Mounting Type:Through Hole, 6116LA55DB pinout, 6116LA55DB datasheet PDF, 6116LA55DB amp .Beyond Memory Intersil (Renesas Electronics Corporation) 6116LA55DB ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 6116LA55DB


Memory Intersil (Renesas Electronics Corporation) 6116LA55DB Overview

The Memory Intersil (Renesas Electronics Corporation) 6116LA55DB is a high-performance IC SRAM, offering 16 Kbit of parallel storage capacity, encapsulated in a robust 24-pin CDIP (Ceramic Dual In-line Package). This memory chip is designed to provide reliable, fast read and write operations, suitable for a broad range of industrial and commercial applications that require bulk data storage with quick access times. Its durability and operational efficiency make it an ideal choice for demanding environments where memory integrity and data stability are crucial.

6116LA55DB Features

This SRAM chip features a 16 Kbit parallel interface, allowing for high-speed data access and simple integration into existing hardware setups. The ceramic package enhances thermal stability and offers superior protection against physical and environmental stress, thus extending the lifespan of the component in harsh working conditions.

6116LA55DB Applications

  • Embedded Systems: Utilized for buffering and data storage, enhancing performance and reliability of system operations.
  • Telecommunication Equipment: Acts as temporary data storage for message processing and routing, ensuring efficient communication flow.
  • Automotive Electronics: Supports advanced diagnostics and system management functions, improving vehicle reliability and performance.
  • Industrial Control Systems: Manages data logging and real-time system monitoring, critical for maintaining operational accuracy and safety.
  • Consumer Electronics: Provides memory solutions for home appliances and entertainment systems, enabling enhanced functionality and user interfaces.
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Shipping Cost

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