5SGXMBBR2H43C3N
- Mfr.Part #
- 5SGXMBBR2H43C3N
- Manufacturer
- Altera (Intel)
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1760HBGA
- Stock
- 41,599
- In Stock :
- 41,599
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Packaging :
- Tray
- JESD-30 Code :
- S-PBGA-B1760
- Number of Logic Elements/Cells :
- 952000
- Number of LABs/CLBs :
- 359200
- Factory Lead Time :
- 8 Weeks
- Total RAM Bits :
- 53248000
- Surface Mount :
- yes
- Supply Voltage :
- 0.85V
- Operating Temperature :
- 0°C~85°C TJ
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RoHS Status :
- RoHS Compliant
- Number of Inputs :
- 600
- HTS Code :
- 8542.39.00.01
- Qualification Status :
- Not Qualified
- Series :
- Stratix® V GX
- Base Part Number :
- 5SGXMBB
- Terminal Form :
- Ball
- Length :
- 45mm
- Voltage - Supply :
- 0.82V~0.88V
- Width :
- 45mm
- Number of I/O :
- 600
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 1760-BBGA, FCBGA
- Mounting Type :
- Surface Mount
- Power Supplies :
- 0.851.52.52.5/31.2/3V
- Organization :
- 35920 CLBS
- Number of Outputs :
- 600
- Height Seated (Max) :
- 4mm
- Datasheets
- 5SGXMBBR2H43C3N

FPGAs Altera 5SGXMBBR2H43C3N Overview
The FPGAs Altera 5SGXMBBR2H43C3N by Intel is a high-performance integrated circuit specifically engineered for advanced systems requiring high-speed data processing and flexible hardware configuration. This IC FPGA part offers a substantial platform for designers focusing on data-intensive applications. It is encapsulated in a 1760HBGA package, ensuring robust performance and reliability. The availability of 600 I/Os makes it an excellent choice for complex digital circuits that demand extensive interfacing with other hardware components, ensuring scalability and adaptability in system design.
5SGXMBBR2H43C3N Features
The 5SGXMBBR2H43C3N FPGA provides a powerful suite of features tailored for high-end applications. It includes a large array of logic elements and embedded memory, allowing for efficient and sophisticated system-level integration. The flexibility provided by its reprogrammable nature allows system developers to make hardware changes during the product lifecycle, enhancing product adaptability to evolving technological standards and requirements. The integration in a 1760HBGA package also offers superior heat dissipation, which is critical in maintaining system stability and performance under heavy operational loads.
5SGXMBBR2H43C3N Applications
- Data Centers: Utilized in server infrastructure to accelerate processing capabilities and manage large-scale data throughput effectively.
- Telecommunications: Critical in base stations and network equipment for handling high-speed data transmission and signal processing.
- Automotive: Employed in driver assistance systems to process real-time data from vehicle sensors and cameras, enhancing safety and driving experience.
- Medical Imaging: Used in diagnostic equipment like MRI and CT scanners for fast image processing and real-time diagnostic data analysis.
- Industrial Automation: Integral in controlling and managing automated production lines, improving efficiency and precision in manufacturing processes.
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