5SGXMB9R2H43I3LN

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Mfr.Part #
5SGXMB9R2H43I3LN
Manufacturer
Altera (Intel)
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 1760HBGA
Stock
18,368
In Stock :
18,368

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Packaging :
Tray
Factory Lead Time :
8 Weeks
Number of Outputs :
600
Width :
45mm
Qualification Status :
Not Qualified
Organization :
31700 CLBS
Number of Inputs :
600
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
600
Terminal Form :
Ball
Power Supplies :
0.851.52.52.5/31.2/3V
Terminal Position :
BOTTOM
Terminal Pitch :
1mm
Number of LABs/CLBs :
317000
Surface Mount :
yes
Height Seated (Max) :
4mm
Base Part Number :
5SGXMB9
Total RAM Bits :
53248000
Operating Temperature :
-40°C~100°C TJ
Package / Case :
1760-BBGA, FCBGA
Voltage - Supply :
0.82V~0.88V
HTS Code :
8542.39.00.01
Series :
Stratix® V GX
RoHS Status :
RoHS Compliant
Number of Logic Elements/Cells :
840000
Length :
45mm
Mounting Type :
Surface Mount
JESD-30 Code :
S-PBGA-B1760
Supply Voltage :
0.85V
Datasheets
5SGXMB9R2H43I3LN
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMB9R2H43I3LN from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:5SGXMB9, Operating Temperature:-40°C~100°C TJ, Package / Case:1760-BBGA, FCBGA, Mounting Type:Surface Mount, 5SGXMB9R2H43I3LN pinout, 5SGXMB9R2H43I3LN datasheet PDF, 5SGXMB9R2H43I3LN amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMB9R2H43I3LN ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGXMB9R2H43I3LN


FPGAs Altera (Intel) 5SGXMB9R2H43I3LN Overview

The FPGAs Altera (Intel) 5SGXMB9R2H43I3LN represents a pinnacle in the field of programmable logic solutions, engineered to meet the demands of high-performance, high-capacity applications. This FPGA device, part of Intel's esteemed Stratix series, is tailored for designers who need substantial logic density, extensive I/O interfaces, and exceptional processing power. Its architecture is optimized for rapid prototyping and complex digital signal processing, making it an ideal choice for developers aiming to accelerate their time-to-market. With the capacity to integrate multiple functions on a single chip, it reduces overall system costs and enhances reliability, which is crucial for B2B customers looking to deploy scalable and efficient designs in their solutions.

5SGXMB9R2H43I3LN Features

The 5SGXMB9R2H43I3LN FPGA boasts an impressive array of features including 600 user I/O pins, allowing for versatile connectivity and integration capabilities in complex systems. Housed in a 1760-pin HBGA (Heat-Spread Ball Grid Array) package, it provides robust support for high-speed signal integrity. Additionally, the chip supports a variety of I/O standards and has a flexible logic architecture, which is highly adaptable to evolving project requirements and technologies.

5SGXMB9R2H43I3LN Applications

  • Telecommunications: Utilized in routers and switches, this FPGA facilitates the handling of high-speed data transmission and advanced signal processing.
  • Automotive: Crucial for driver assistance systems, it manages multiple high-speed signals and data processing concurrently, ensuring safety and performance.
  • Industrial: Applied in automation systems, the FPGA enhances the reliability and speed of robotics and control systems.
  • Data Centers: Supports the infrastructure for high-speed computing tasks, aiding in the efficient processing of vast amounts of data.
  • Medical Equipment: Used in imaging and diagnostic devices, the FPGA processes complex algorithms quickly, aiding in faster and more accurate medical analysis.
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