5SGXMB6R3F43C4N
- Mfr.Part #
- 5SGXMB6R3F43C4N
- Manufacturer
- Altera (Intel)
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1760FBGA
- Stock
- 18,977
- In Stock :
- 18,977
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Package / Case :
- 1760-BBGA, FCBGA
- RoHS Status :
- RoHS Compliant
- Surface Mount :
- yes
- HTS Code :
- 8542.39.00.01
- Power Supplies :
- 0.851.52.52.5/31.2/3V
- Terminal Pitch :
- 1mm
- Height Seated (Max) :
- 3.4mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Outputs :
- 600
- Qualification Status :
- Not Qualified
- Number of Logic Elements/Cells :
- 597000
- Number of LABs/CLBs :
- 225400
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 8 Weeks
- Number of Inputs :
- 600
- Base Part Number :
- 5SGXMB6
- Terminal Form :
- Ball
- Width :
- 42.5mm
- Series :
- Stratix® V GX
- Number of I/O :
- 600
- Length :
- 42.5mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits :
- 53248000
- JESD-30 Code :
- S-PBGA-B1760
- Operating Temperature :
- 0°C~85°C TJ
- Voltage - Supply :
- 0.82V~0.88V
- Terminal Position :
- BOTTOM
- Supply Voltage :
- 0.85V
- Organization :
- 22540 CLBS
- Packaging :
- Tray
- Datasheets
- 5SGXMB6R3F43C4N

FPGAs Altera 5SGXMB6R3F43C4N Overview
The FPGAs Altera 5SGXMB6R3F43C4N by Intel represents the pinnacle of programmable logic technology, offering a robust platform for specialized applications requiring high performance and extensive I/O capabilities. Engineered for efficiency and scalability, this IC FPGA is housed in a 1760FBGA package, ensuring a compact footprint while supporting 600 user I/Os, making it an ideal choice for dense and complex hardware environments. Its versatility and high integration make it particularly suited for designers looking to push the boundaries of technological innovation in competitive markets.
5SGXMB6R3F43C4N Features
This FPGA model boasts significant features that enhance its utility across various demanding applications. Key features include its high-density integration, support for 600 I/O ports, and a flexible 1760FBGA packaging that facilitates superior signal integrity and thermal management. Additionally, its compatibility with Intel's sophisticated design software provides users with a streamlined development experience, enabling faster time-to-market for complex electronic products.
5SGXMB6R3F43C4N Applications
- Telecommunications Infrastructure: Utilized in routers and switches for packet processing, traffic management, and signal integrity enhancement, adapting to the needs of robust telecommunication networks.
- Data Centers: Drives the backbone of high-speed computing servers and storage systems, ensuring efficient data throughput and reliable operation under high-load conditions.
- Automotive Technology: Integrated into driver assistance systems and infotainment systems to process real-time data and deliver enhanced vehicle performance and safety.
- Industrial Automation: Applied in complex machine control systems, contributing to enhanced operational efficiency and reliability in automated manufacturing processes.
- Aerospace and Defense: Critical for the development of avionics and military hardware, where high levels of data processing and system reliability are mandatory.
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