5SGXMB6R3F40I3LN
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- Mfr.Part #
- 5SGXMB6R3F40I3LN
- Manufacturer
- Altera (Intel)
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 432 I/O 1517FBGA
- Stock
- 4,354
- In Stock ：
- 4,354
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Supply Voltage :
- 0.85V
- Number of Logic Elements/Cells :
- 597000
- Organization :
- 22540 CLBS
- HTS Code :
- 8542.39.00.01
- Operating Temperature :
- -40°C~100°C TJ
- Factory Lead Time :
- 8 Weeks
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Pitch :
- 1mm
- Power Supplies :
- 0.851.52.52.5/31.2/3V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Series :
- Stratix® V GX
- Number of Inputs :
- 432
- Mounting Type :
- Surface Mount
- Length :
- 40mm
- Voltage - Supply :
- 0.82V~0.88V
- RoHS Status :
- RoHS Compliant
- Number of I/O :
- 432
- Height Seated (Max) :
- 3.5mm
- Qualification Status :
- Not Qualified
- Package / Case :
- 1517-BBGA, FCBGA
- Width :
- 40mm
- JESD-30 Code :
- S-PBGA-B1517
- Number of LABs/CLBs :
- 225400
- Surface Mount :
- yes
- Number of Outputs :
- 432
- Total RAM Bits :
- 53248000
- Terminal Position :
- BOTTOM
- Base Part Number :
- 5SGXMB6
- Packaging :
- Tray
- Terminal Form :
- Ball
- Datasheets
- 5SGXMB6R3F40I3LN
FPGAs Altera 5SGXMB6R3F40I3LN Overview
The FPGAs Altera 5SGXMB6R3F40I3LN, designed and manufactured by Intel's Altera division, is a highly versatile and powerful field-programmable gate array (FPGA) tailored for sophisticated, high-performance applications. This FPGA stands out in the market for its substantial logic density and configurability, making it ideal for developers looking to push the boundaries of digital circuit design. The 5SGXMB6R3F40I3LN is housed in a 1517-pin fine-pitch ball grid array (FBGA) package, providing a robust platform for the most demanding designs with its 432 user I/Os, enhancing its utility in complex, multi-faceted projects.
5SGXMB6R3F40I3LN Features
This FPGA boasts an impressive array of features that facilitate robust, scalable, and flexible design solutions. Key features include a high I/O pin count which is essential for complex, multi-layered designs. The device supports various I/O standards, ensuring compatibility with numerous existing technologies and future-proofing investments. The FBGA packaging allows for efficient heat dissipation and reduced footprint on the PCB, making it a perfect choice for space-constrained applications while maintaining high performance.
5SGXMB6R3F40I3LN Applications
- Data Centers: Utilized in server farms for accelerating data processing tasks, enhancing overall efficiency and reducing latency in data transactions.
- Telecommunications: Critical in the development of telecom hardware where high-speed signal processing is necessary for router and switch management.
- Automotive: Employs in driver assistance systems (ADAS) to process real-time inputs from vehicle sensors, supporting safety enhancements and autonomous driving technologies.
- Medical Devices: Integral to medical imaging systems, where rapid processing of complex data sets is critical for accurate diagnostics.
- Industrial Automation: Applied in control systems for real-time machine management, increasing the efficiency and precision of automated tasks.
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