5SGXMABN2F45I3LN

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Mfr.Part #
5SGXMABN2F45I3LN
Manufacturer
Altera (Intel)
Package / Case
1932-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 840 I/O 1932FBGA
Stock
32,828
In Stock :
32,828

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Series :
Stratix® V GX
Number of Outputs :
840
Operating Temperature :
-40°C~100°C TJ
Length :
45mm
Number of I/O :
840
Height Seated (Max) :
3.9mm
Voltage - Supply :
0.82V~0.88V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Packaging :
Tray
Qualification Status :
Not Qualified
Base Part Number :
5SGXMAB
Supply Voltage :
0.85V
Organization :
35920 CLBS
Power Supplies :
0.851.52.52.5/31.2/3V
RoHS Status :
RoHS Compliant
Number of Logic Elements/Cells :
952000
Terminal Form :
Ball
Package / Case :
1932-BBGA, FCBGA
Terminal Position :
BOTTOM
Total RAM Bits :
53248000
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Pitch :
1mm
HTS Code :
8542.39.00.01
Mounting Type :
Surface Mount
Number of Inputs :
840
JESD-30 Code :
S-PBGA-B1932
Width :
45mm
Factory Lead Time :
8 Weeks
Number of LABs/CLBs :
359200
Surface Mount :
yes
Datasheets
5SGXMABN2F45I3LN
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMABN2F45I3LN from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Base Part Number:5SGXMAB, Package / Case:1932-BBGA, FCBGA, Mounting Type:Surface Mount, 5SGXMABN2F45I3LN pinout, 5SGXMABN2F45I3LN datasheet PDF, 5SGXMABN2F45I3LN amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMABN2F45I3LN ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGXMABN2F45I3LN


FPGAs Altera (Intel) 5SGXMABN2F45I3LN Overview

The FPGAs Altera (Intel) 5SGXMABN2F45I3LN represents the pinnacle of flexible, high-density, high-performance programmable logic solutions. Engineered by Altera, now part of Intel, this FPGA device offers a superior platform for the development of high-speed and complex digital systems. Its integration into the 1932FBGA package allows for a streamlined footprint suitable for advanced system-on-chip (SoC) applications. This product is particularly designed to meet the stringent demands of applications requiring massive I/O interfacing and substantial logic capacity, making it an essential component for developers aiming to push the boundaries of technological innovation.

5SGXMABN2F45I3LN Features

The 5SGXMABN2F45I3LN FPGA offers extensive features that support advanced digital processing capabilities. Notable among these is its support for up to 840 I/O pins, which provide unparalleled flexibility for system design. The device is housed in a 1932FBGA package, ensuring robust physical protection and enhanced thermal management. Its high integration supports complex, multi-functional system deployments without compromising on performance or power efficiency.

5SGXMABN2F45I3LN Applications

  • Data Centers: Used in server architectures to handle massive data throughput and complex processing tasks, enhancing performance and scalability.
  • Telecommunications: Critical in the development of telecommunications infrastructure, such as in base stations and network switches, where high-speed signal processing and flexibility are required.
  • Automotive: Implements advanced driver-assistance systems (ADAS) and other in-vehicle networks, providing the necessary speed and connectivity for safety-critical functions.
  • Industrial Automation: Applied in control systems and robotic applications where high I/O count and real-time processing are crucial for operational efficiency and reliability.
  • Medical Devices: Integral to medical imaging systems, such as MRI and ultrasound devices, where high data bandwidth and precise control over complex computations are necessary.
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