5SGXMA4K3F35I3N
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- Mfr.Part #
- 5SGXMA4K3F35I3N
- Manufacturer
- Altera (Intel)
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1152FBGA
- Stock
- 36,699
- In Stock ：
- 36,699
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Height Seated (Max) :
- 3.6mm
- Terminal Form :
- Ball
- Number of I/O :
- 432
- Mounting Type :
- Surface Mount
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells :
- 420000
- Surface Mount :
- yes
- Supply Voltage :
- 0.85V
- Number of LABs/CLBs :
- 158500
- Factory Lead Time :
- 8 Weeks
- Operating Temperature :
- -40°C~100°C TJ
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Pitch :
- 1mm
- Voltage - Supply :
- 0.82V~0.88V
- Number of Inputs :
- 432
- Series :
- Stratix® V GX
- Number of Outputs :
- 432
- Qualification Status :
- Not Qualified
- Total RAM Bits :
- 37888000
- Base Part Number :
- 5SGXMA4
- RoHS Status :
- RoHS Compliant
- Packaging :
- Tray
- Width :
- 35mm
- Package / Case :
- 1152-BBGA, FCBGA
- Organization :
- 15850 CLBS
- Terminal Position :
- BOTTOM
- Length :
- 35mm
- JESD-30 Code :
- S-PBGA-B1152
- Power Supplies :
- 0.851.52.52.5/31.2/3V
- Datasheets
- 5SGXMA4K3F35I3N
FPGAs Altera (Intel) 5SGXMA4K3F35I3N Overview
The FPGAs Altera (Intel) 5SGXMA4K3F35I3N is a high-performance, field-programmable gate array designed for demanding applications that require high I/O interface density, superior memory bandwidth, and flexibility. Manufactured by Altera, now part of Intel, this FPGA is built on advanced technology, ensuring optimal performance and efficiency. With its 1152-pin fine-pitch ball grid array (FBGA) packaging, the 5SGXMA4K3F35I3N integrates seamlessly into a variety of system architectures, providing a scalable, customizable solution for sophisticated digital processing needs.
5SGXMA4K3F35I3N Features
This IC FPGA from Altera (Intel) features 600 user I/O pins, enabling extensive connectivity and high configurability for complex designs. Its versatile 1152FBGA package facilitates efficient thermal management and compact board design, making it an ideal choice for high-density applications that also require a small form factor.
5SGXMA4K3F35I3N Applications
- Telecommunications Infrastructure: Utilized in networking hardware such as routers and switches to manage data traffic efficiently and provide robust connectivity solutions.
- Data Center Solutions: Ideal for use in data processing units within data centers to handle massive data throughputs and complex processing tasks with ease.
- Industrial Automation: Drives control and processing units in automated manufacturing systems, enhancing operational efficiency and machine-to-machine communication.
- Automotive Technology: Applied in advanced driver-assistance systems (ADAS) to process real-time data from vehicle sensors and support safety-critical functions.
- Aerospace and Defense: Crucial in the design of avionics and military hardware, offering the necessary reliability and performance under extreme conditions.
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