5SGXMA3K2F40C3N

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Mfr.Part #
5SGXMA3K2F40C3N
Manufacturer
Altera (Intel)
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 1517FBGA
Stock
13,224
In Stock :
13,224

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
19456000
Terminal Pitch :
1mm
Number of Logic Elements/Cells :
340000
Length :
40mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
0.82V~0.88V
Number of Inputs :
696
JESD-30 Code :
S-PBGA-B1517
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
HTS Code :
8542.39.00.01
Terminal Position :
BOTTOM
Number of LABs/CLBs :
128300
Operating Temperature :
0°C~85°C TJ
Packaging :
Tray
Series :
Stratix® V GX
Base Part Number :
5SGXMA3
Mounting Type :
Surface Mount
Factory Lead Time :
8 Weeks
Organization :
12830 CLBS
ECCN Code :
3A001.A.7.A
Surface Mount :
yes
Height Seated (Max) :
3.5mm
Package / Case :
1517-BBGA, FCBGA
Supply Voltage :
0.85V
RoHS Status :
RoHS Compliant
Number of I/O :
696
Width :
40mm
Terminal Form :
Ball
Number of Outputs :
696
Power Supplies :
0.851.52.52.5/31.2/3V
Qualification Status :
Not Qualified
Datasheets
5SGXMA3K2F40C3N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3K2F40C3N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Base Part Number:5SGXMA3, Mounting Type:Surface Mount, Package / Case:1517-BBGA, FCBGA, 5SGXMA3K2F40C3N pinout, 5SGXMA3K2F40C3N datasheet PDF, 5SGXMA3K2F40C3N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3K2F40C3N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGXMA3K2F40C3N


FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3K2F40C3N Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3K2F40C3N is a high-performance integrated circuit designed by Altera, now part of Intel. This FPGA features a 1517-pin FineLine BGA (FBGA) package and supports a vast array of configurable logic blocks along with 600 user I/O options, making it extremely versatile for complex digital computations and signal processing. Its robust architecture and high I/O count make it ideal for intensive applications that require speed, efficiency, and reliability.

5SGXMA3K2F40C3N Features

  • High I/O Pin Count: Includes 600 user I/O pins, allowing for flexible and extensive interfacing with other components and systems.
  • Large Logic Capacity: Supports intricate logic designs which are crucial for advanced computing solutions.
  • Scalable Architecture: Built to support a range of applications, from simple logic controls to complex system integrations.
  • Power Efficiency: Designed for optimized power consumption, enhancing reliability and sustainability of system designs.

5SGXMA3K2F40C3N Applications

  • Data Centers: Used for managing workloads and enhancing data processing capabilities which require substantial computational power and flexibility.
  • Telecommunication Infrastructure: Crucial for handling high-speed signal processing and data routing in modern communication systems.
  • Automotive Technology: Integrates into driver assistance systems and in-vehicle infotainment systems, providing the necessary computational strength and reliability.
  • Medical Imaging: Applied in advanced medical imaging equipment, ensuring precise data handling and real-time processing capabilities.
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