5SGXMA3K2F35I3N

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Mfr.Part #
5SGXMA3K2F35I3N
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 1152FBGA
Stock
7,951
In Stock :
7,951

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Base Part Number :
5SGXMA3
Surface Mount :
yes
Terminal Form :
Ball
Number of Outputs :
432
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Organization :
12830 CLBS
Total RAM Bits :
19456000
Width :
35mm
Terminal Position :
BOTTOM
Number of LABs/CLBs :
128300
Voltage - Supply :
0.82V~0.88V
Number of I/O :
432
Operating Temperature :
-40°C~100°C TJ
JESD-30 Code :
S-PBGA-B1152
Package / Case :
1152-BBGA, FCBGA
Power Supplies :
0.851.52.52.5/31.2/3V
Qualification Status :
Not Qualified
Factory Lead Time :
8 Weeks
Supply Voltage :
0.85V
RoHS Status :
RoHS Compliant
Series :
Stratix® V GX
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Pitch :
1mm
Height Seated (Max) :
3.6mm
Length :
35mm
Mounting Type :
Surface Mount
Number of Logic Elements/Cells :
340000
Number of Inputs :
432
Datasheets
5SGXMA3K2F35I3N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3K2F35I3N from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:5SGXMA3, Operating Temperature:-40°C~100°C TJ, Package / Case:1152-BBGA, FCBGA, Mounting Type:Surface Mount, 5SGXMA3K2F35I3N pinout, 5SGXMA3K2F35I3N datasheet PDF, 5SGXMA3K2F35I3N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3K2F35I3N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGXMA3K2F35I3N


FPGAs Altera (Intel) 5SGXMA3K2F35I3N Overview

The FPGAs Altera (Intel) 5SGXMA3K2F35I3N is a high-performance field-programmable gate array designed for sophisticated applications that demand high speed, extensive I/O capabilities, and flexible integration. Manufactured by Altera, now part of Intel, this FPGA features a robust 1152-pin FBGA package, allowing for dense circuit integration and advanced heat dissipation. This device is engineered to deliver exceptional performance enhancements in data processing and signal conditioning, making it an ideal choice for developers aiming to push the boundaries of technology in various industries.

5SGXMA3K2F35I3N Features

This FPGA model boasts 600 user I/O pins, enabling extensive connectivity and integration possibilities for various system designs. Its integrated transceivers support high-speed data transmission, which is essential for applications such as high-speed networking and real-time data processing. The device's large logic density and memory capacity allow for the implementation of complex algorithms and processes, providing developers with the flexibility to optimize system performance and functionality.

5SGXMA3K2F35I3N Applications

  • Telecommunications: Utilized in infrastructure for supporting high-speed data and signal processing, enhancing capabilities in 5G networks and broadband services.
  • Data Centers: Serves as a core component in data storage and management systems, enabling rapid data processing and increased storage capabilities.
  • Industrial Automation: Employs in control systems to improve precision and efficiency, crucial for modern manufacturing environments.
  • Automotive: Integrated into driver assistance systems, helping to process real-time data from sensors and improving vehicle safety and functionality.
  • Aerospace and Defense: Utilized for signal and data processing applications that require high levels of reliability and performance under extreme conditions.
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