5SGXMA3K2F35I2N

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Mfr.Part #
5SGXMA3K2F35I2N
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 1152FBGA
Stock
6,293
In Stock :
6,293

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Width :
35mm
Voltage - Supply :
0.87V~0.93V
Supply Voltage :
0.9V
Length :
35mm
Factory Lead Time :
8 Weeks
Operating Temperature :
-40°C~100°C TJ
Number of Logic Elements/Cells :
340000
Mounting Type :
Surface Mount
Total RAM Bits :
19456000
JESD-30 Code :
S-PBGA-B1152
Number of I/O :
432
RoHS Status :
RoHS Compliant
Base Part Number :
5SGXMA3
Qualification Status :
Not Qualified
Height Seated (Max) :
3.6mm
Packaging :
Tray
Number of LABs/CLBs :
128300
Series :
Stratix® V GX
HTS Code :
8542.39.00.01
Terminal Pitch :
1mm
Terminal Form :
Ball
Organization :
12830 CLBS
Number of Outputs :
432
Package / Case :
1152-BBGA, FCBGA
Number of Inputs :
432
Power Supplies :
0.91.52.52.5/31.2/3V
Surface Mount :
yes
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Position :
BOTTOM
Datasheets
5SGXMA3K2F35I2N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3K2F35I2N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, Base Part Number:5SGXMA3, Package / Case:1152-BBGA, FCBGA, 5SGXMA3K2F35I2N pinout, 5SGXMA3K2F35I2N datasheet PDF, 5SGXMA3K2F35I2N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3K2F35I2N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGXMA3K2F35I2N


FPGAs Altera 5SGXMA3K2F35I2N Overview

The FPGAs Altera 5SGXMA3K2F35I2N, manufactured by Altera (Intel), represents a pinnacle of technological innovation in the field of programmable logic devices. This integrated circuit, housed in a 1152FBGA package, is engineered to meet the complex demands of high-throughput, high-density applications. The device offers an exceptional combination of performance and flexibility, enabling designers to optimize their systems for both speed and power efficiency. With 600 I/O options, this FPGA is ideally suited for advanced system-level integration in a variety of industrial and commercial applications.

5SGXMA3K2F35I2N Features

This FPGA is designed with numerous features that make it a robust choice for developers and engineers. Key features include its high I/O pin count, extensive logic resources, and compatibility with Intel's sophisticated technology ecosystem. The device's ability to support high-speed transceiver data rates and its integration of advanced memory interfaces underscore its utility in handling complex, data-intensive tasks. Additionally, the FPGA's adaptive logic modules and embedded DSP blocks facilitate efficient processing and manipulation of high-speed digital signals.

5SGXMA3K2F35I2N Applications

  • Data Centers: Utilized in servers for accelerating data processing tasks and network packet processing, enhancing overall data throughput and energy efficiency.
  • Telecommunications: Employed in communication infrastructure equipment such as routers and switches, enabling high-speed signal processing and increased bandwidth capabilities.
  • Automotive: Integrated into automotive systems for advanced driver-assistance systems (ADAS), providing necessary computational power for real-time decision making.
  • Video Processing: Used in video conferencing systems and digital broadcasting equipment, facilitating real-time video encoding and decoding.
  • Military and Aerospace: Applied in radar and navigation systems, ensuring robust data processing capabilities that meet stringent reliability and precision standards.
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