5SGXMA3K2F35C1N
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- Mfr.Part #
- 5SGXMA3K2F35C1N
- Manufacturer
- Altera (Intel)
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1152FBGA
- Stock
- 34,066
- In Stock ：
- 34,066
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Total RAM Bits :
- 19456000
- Power Supplies :
- 0.91.52.52.5/31.2/3V
- Supply Voltage :
- 0.9V
- Voltage - Supply :
- 0.87V~0.93V
- Terminal Form :
- Ball
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Qualification Status :
- Not Qualified
- Terminal Pitch :
- 1mm
- Organization :
- 12830 CLBS
- Number of Outputs :
- 432
- Operating Temperature :
- 0°C~85°C TJ
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Inputs :
- 432
- HTS Code :
- 8542.39.00.01
- Packaging :
- Tray
- RoHS Status :
- RoHS Compliant
- Mounting Type :
- Surface Mount
- Series :
- Stratix® V GX
- Terminal Position :
- BOTTOM
- Number of I/O :
- 432
- Factory Lead Time :
- 8 Weeks
- Surface Mount :
- yes
- Width :
- 35mm
- JESD-30 Code :
- S-PBGA-B1152
- Base Part Number :
- 5SGXMA3
- Package / Case :
- 1152-BBGA, FCBGA
- Number of LABs/CLBs :
- 128300
- Length :
- 35mm
- Number of Logic Elements/Cells :
- 340000
- Height Seated (Max) :
- 3.6mm
- Datasheets
- 5SGXMA3K2F35C1N
FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3K2F35C1N Overview
The FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3K2F35C1N is a highly versatile integrated circuit, designed by Altera, now part of Intel, specifically tailored for high-performance applications requiring flexible, high-speed programmability. With its substantial logic resources, advanced interface capabilities, and high integration, this FPGA is engineered to handle complex digital computations and signal processing tasks efficiently. Its adaptability makes it ideal for a wide range of industrial applications, underpinning its utility in sectors demanding robust, scalable solutions.
5SGXMA3K2F35C1N Features
The 5SGXMA3K2F35C1N FPGA boasts a plethora of features designed for optimal performance in demanding environments. Key attributes include 600 user I/Os, which provide extensive connectivity options. The chip is housed in a 1152FBGA (Fine Pitch Ball Grid Array) package, ensuring a compact footprint while allowing for efficient thermal management and high-density integration. These technical specifications make it an excellent choice for developers looking to push the boundaries of what's possible with digital and mixed-signal applications.
5SGXMA3K2F35C1N Applications
- Telecommunications: Used in network infrastructure to manage signal processing and data flow, enhancing bandwidth and reducing latency.
- Automotive Systems: Integral in advanced driver-assistance systems (ADAS) for processing real-time sensor data and making split-second decisions.
- Industrial Automation: Helps in managing complex control systems and machinery with high reliability and precision.
- Data Centers: Crucial for accelerating workloads such as data processing and storage management, improving overall efficiency.
- Medical Devices: Used in diagnostic and imaging equipment to process complex biomedical data accurately and quickly.
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