5SGXMA3E2H29I3LN

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Mfr.Part #
5SGXMA3E2H29I3LN
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 780HBGA
Stock
41,685
In Stock :
41,685

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mounting Type :
Surface Mount
RoHS Status :
RoHS Compliant
Surface Mount :
yes
Supply Voltage :
0.85V
Number of LABs/CLBs :
128300
Number of Logic Elements/Cells :
340000
Voltage - Supply :
0.82V~0.88V
Height Seated (Max) :
3.6mm
Terminal Form :
Ball
Number of Inputs :
360
Number of Terminations :
780
Terminal Position :
BOTTOM
JESD-30 Code :
S-PBGA-B780
Qualification Status :
Not Qualified
Length :
33mm
Packaging :
Tray
Factory Lead Time :
8 Weeks
Base Part Number :
5SGXMA3
Organization :
12830 CLBS
Number of I/O :
360
HTS Code :
8542.39.00.01
Package / Case :
780-BBGA, FCBGA
Number of Outputs :
360
Operating Temperature :
-40°C~100°C TJ
Total RAM Bits :
19456000
Terminal Pitch :
1mm
Power Supplies :
0.851.52.52.5/31.2/3V
Width :
33mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
Stratix® V GX
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3E2H29I3LN from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:780, Base Part Number:5SGXMA3, Package / Case:780-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, 5SGXMA3E2H29I3LN pinout, 5SGXMA3E2H29I3LN datasheet PDF, 5SGXMA3E2H29I3LN amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3E2H29I3LN ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGXMA3E2H29I3LN


FPGAs Altera (Intel) 5SGXMA3E2H29I3LN Overview

The FPGAs Altera (Intel) 5SGXMA3E2H29I3LN is a high-performance integrated circuit developed by Intel, formerly known as Altera. This Field Programmable Gate Array (FPGA) is designed for advanced systems requiring high-speed data processing and flexible hardware configuration. With its vast I/O capabilities and a dense 780-ball BGA (ball grid array) packaging, it is perfectly suited for complex digital processing tasks in a variety of industrial applications. The use of this FPGA can significantly reduce time to market and development costs, while providing the adaptability necessary to meet evolving technological demands.

5SGXMA3E2H29I3LN Features

This specific model boasts up to 600 user I/O pins, allowing for extensive connectivity and integration capabilities. The FPGA is housed in a compact 780HBGA package, providing robust performance in a small footprint. Enhanced features include high-speed transceivers, abundant logic elements, and integrated DSP blocks, facilitating the creation of high-density, multifunctional electronic devices. Its architecture is optimized for energy efficiency, crucial for sustainable, long-term deployments.

5SGXMA3E2H29I3LN Applications

  • Data Centers: Utilized in server farms for accelerating data processing tasks, enhancing overall efficiency and throughput.
  • Telecommunications: Employs its high I/O count and fast transceivers to manage signal processing tasks in communication infrastructure.
  • Medical Devices: Critical for real-time processing in medical imaging equipment, enhancing resolution and diagnostic capabilities.
  • Automotive: Supports advanced driver-assistance systems (ADAS) by processing multiple inputs from sensors and cameras swiftly and reliably.
  • Aerospace and Defense: Applied in navigation and control systems, where reliability and precision are paramount.
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