5SGXMA3E2H29C2L

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Mfr.Part #
5SGXMA3E2H29C2L
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 780HBGA
Stock
38,353
In Stock :
38,353

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Number of Outputs :
360
Number of Logic Elements/Cells :
340000
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
19456000
Number of LABs/CLBs :
128300
Width :
33mm
Organization :
12830 CLBS
Operating Temperature :
0°C~85°C TJ
Package / Case :
780-BBGA, FCBGA
Series :
Stratix® V GX
Voltage - Supply :
0.82V~0.88V
HTS Code :
8542.39.00.01
Terminal Position :
BOTTOM
JESD-30 Code :
S-PBGA-B780
Factory Lead Time :
8 Weeks
Qualification Status :
Not Qualified
Number of I/O :
360
Supply Voltage :
0.85V
Length :
33mm
RoHS Status :
RoHS Compliant
Number of Terminations :
780
Number of Inputs :
360
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Height Seated (Max) :
3.6mm
Power Supplies :
0.851.52.52.5/31.2/3V
Surface Mount :
yes
Packaging :
Tray
Terminal Pitch :
1mm
Base Part Number :
5SGXMA3
Datasheets
5SGXMA3E2H29C2L
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3E2H29C2L from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:780-BBGA, FCBGA, Number of Terminations:780, Base Part Number:5SGXMA3, 5SGXMA3E2H29C2L pinout, 5SGXMA3E2H29C2L datasheet PDF, 5SGXMA3E2H29C2L amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3E2H29C2L ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGXMA3E2H29C2L


FPGAs Altera (Intel) 5SGXMA3E2H29C2L Overview

The FPGAs Altera (Intel) 5SGXMA3E2H29C2L is a high-performance integrated circuit specifically designed to meet the demanding requirements of modern digital applications. Engineered by Altera (now part of Intel), this FPGA features a robust suite of technologies capable of handling complex computations and data processing. With 600 user-configurable I/Os housed in a 780-pin HBGA package, this device offers versatility and high-density integration, making it an ideal solution for designers aiming to optimize system performance and reduce time-to-market in competitive tech industries.

5SGXMA3E2H29C2L Features

This IC FPGA stands out for its high I/O count and compact form factor. The 780HBGA package allows for a dense yet manageable layout, accommodating the extensive functionality within modern embedded systems. The FPGA architecture supports reprogrammability and flexibility, enabling engineers to update functionality without hardware changes, a critical feature in rapidly evolving markets.

5SGXMA3E2H29C2L Applications

  • Telecommunications Equipment - The FPGA can be utilized for signal processing and data flow management, enhancing the efficiency and reliability of telecommunications systems.
  • Data Centers - Ideal for managing data throughput and multiple operation tasks simultaneously, ensuring smooth data processing and storage operations.
  • Aerospace and Defense - Suitable for applications requiring high levels of data integrity and operational security, the FPGA provides robust performance in challenging environments.
  • Medical Imaging Systems - Supports the complex computations required for real-time image processing, aiding in more accurate and quicker diagnostics.
  • Automotive - Can be integrated into automotive systems for sensor data processing and real-time decision-making, crucial for autonomous driving technologies.
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