5SGXMA3E2H29C1N

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Mfr.Part #
5SGXMA3E2H29C1N
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 780HBGA
Stock
47,429
In Stock :
47,429

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Supplier Device Package :
780-HBGA (33x33)
Package / Case :
780-BBGA, FCBGA
Factory Lead Time :
8 Weeks
Voltage - Supply :
0.87V~0.93V
Number of I/O :
360
Series :
Stratix® V GX
Mounting Type :
Surface Mount
RoHS Status :
RoHS Compliant
Packaging :
Tray
Number of LABs/CLBs :
128300
Base Part Number :
5SGXMA3
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Total RAM Bits :
19456000
Number of Logic Elements/Cells :
340000
Operating Temperature :
0°C~85°C TJ
Datasheets
5SGXMA3E2H29C1N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3E2H29C1N from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:780-BBGA, FCBGA, Mounting Type:Surface Mount, Base Part Number:5SGXMA3, Operating Temperature:0°C~85°C TJ, 5SGXMA3E2H29C1N pinout, 5SGXMA3E2H29C1N datasheet PDF, 5SGXMA3E2H29C1N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXMA3E2H29C1N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGXMA3E2H29C1N


FPGAs Altera (Intel) 5SGXMA3E2H29C1N Overview

The FPGAs Altera (Intel) 5SGXMA3E2H29C1N integrates advanced technology and high functionality in a single chip, designed to meet the intricate requirements of modern digital systems. This IC FPGA from Altera, now part of Intel, is tailored for designers looking to leverage the speed and flexibility of FPGAs with a high pin count and ample logic resources. It provides a robust platform for developing high-performance, multi-functional applications across various industries.

5SGXMA3E2H29C1N Features

The 5SGXMA3E2H29C1N offers a wide array of features making it an ideal choice for high-demand applications. It houses 600 user I/Os, facilitating extensive interfacing capabilities. The device is packaged in a 780-ball BGA (ball grid array), which supports dense and compact PCB (printed circuit board) designs. Enhanced with high-speed transceiver links and abundant logic elements, this FPGA can handle complex data processing tasks efficiently, reducing development time and enhancing product performance.

5SGXMA3E2H29C1N Applications

  • Telecommunications: Utilized in communication infrastructure to manage data traffic efficiently and ensure robust connectivity.
  • Data Centers: Key in managing vast amounts of data, supporting high-speed data processing and storage solutions.
  • Automotive: Enhances functionality in advanced driver-assistance systems (ADAS) by processing real-time inputs from multiple sensors.
  • Industrial: Applied in automation systems for precision control and real-time processing in manufacturing environments.
  • Consumer Electronics: Used in devices requiring high-speed video and audio processing, ensuring seamless user experiences.
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