5SGXEB6R3F40C2N

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Mfr.Part #
5SGXEB6R3F40C2N
Manufacturer
Altera (Intel)
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 432 I/O 1517FBGA
Stock
43,404
In Stock :
43,404

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
HTS Code :
8542.39.00.01
Power Supplies :
0.851.52.52.5/31.2/3V
Voltage - Supply :
0.87V~0.93V
Number of Logic Elements/Cells :
597000
JESD-30 Code :
S-PBGA-B1517
Number of I/O :
432
Total RAM Bits :
53248000
Number of Outputs :
432
Terminal Form :
Ball
Number of LABs/CLBs :
225400
Package / Case :
1517-BBGA, FCBGA
Surface Mount :
yes
RoHS Status :
RoHS Compliant
Packaging :
Tray
Terminal Position :
BOTTOM
Base Part Number :
5SGXEB6
Operating Temperature :
0°C~85°C TJ
Series :
Stratix® V GX
Length :
40mm
Height Seated (Max) :
3.5mm
Organization :
22540 CLBS
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Inputs :
432
Width :
40mm
Supply Voltage :
0.9V
Qualification Status :
Not Qualified
Terminal Pitch :
1mm
Factory Lead Time :
8 Weeks
Datasheets
5SGXEB6R3F40C2N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXEB6R3F40C2N from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1517-BBGA, FCBGA, Base Part Number:5SGXEB6, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, 5SGXEB6R3F40C2N pinout, 5SGXEB6R3F40C2N datasheet PDF, 5SGXEB6R3F40C2N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXEB6R3F40C2N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGXEB6R3F40C2N


FPGAs Altera 5SGXEB6R3F40C2N Overview

The FPGas Altera 5SGXEB6R3F40C2N from Intel (formerly Altera) represents a high-performance, field-programmable gate array designed for advanced integrated circuit applications. This model features an impressive array of 432 input/output options packaged into a 1517-pin fine-pitch ball grid array (FBGA). Its versatility and high-speed logic capabilities make it an ideal choice for developers looking to implement complex digital circuits that can be configured post-production. The utilization of this FPGA in system designs enhances adaptability and accelerates time to market, making it a vital component for industries requiring rapid prototyping and flexible hardware configurations.

5SGXEB6R3F40C2N Features

The 5SGXEB6R3F40C2N FPGA boasts a robust set of features that cater to demanding digital environments. It supports extensive logic integration, facilitating the development of high-density systems without compromising performance. With 432 I/O pins, it allows for versatile connectivity options, crucial for complex digital systems. The compact 1517FBGA package is designed to minimize space while maximizing reliability and efficiency in signal processing. This device is not only powerful but also optimized for energy efficiency, which is critical in reducing operational costs for end-users.

5SGXEB6R3F40C2N Applications

  • Data Centers: Used in servers for fast processing and data manipulation, this FPGA can handle multiple operations simultaneously, enhancing server efficiency and reliability.
  • Telecommunications: Integrates into telecommunications infrastructure to manage signal processing tasks, providing the agility needed for network adjustments and expansions.
  • Automotive Technology: Employs in advanced driver-assistance systems (ADAS) to process real-time data from vehicle sensors, improving safety and performance on the road.
  • Medical Devices: Utilized in medical imaging systems, such as MRI and ultrasound equipment, for quick processing of complex imaging data, thereby improving diagnostic capabilities.
  • Aerospace and Defense: Applied in satellite communications and avionics for robust and secure data transmission and processing, essential for modern aerospace applications.
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