5SGXEB5R2F43I2LN
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- Mfr.Part #
- 5SGXEB5R2F43I2LN
- Manufacturer
- Altera (Intel)
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1760FBGA
- Stock
- 30,110
- In Stock ：
- 30,110
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Position :
- BOTTOM
- RoHS Status :
- RoHS Compliant
- Terminal Pitch :
- 1mm
- Series :
- Stratix® V GX
- Voltage - Supply :
- 0.82V~0.88V
- Power Supplies :
- 0.851.52.52.5/31.2/3V
- Width :
- 42.5mm
- Length :
- 42.5mm
- Mounting Type :
- Surface Mount
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Total RAM Bits :
- 41984000
- Number of Logic Elements/Cells :
- 490000
- Number of LABs/CLBs :
- 185000
- Packaging :
- Tray
- Number of I/O :
- 600
- Height Seated (Max) :
- 3.4mm
- Package / Case :
- 1760-BBGA, FCBGA
- Surface Mount :
- yes
- Base Part Number :
- 5SGXEB5
- Organization :
- 18500 CLBS
- Operating Temperature :
- -40°C~100°C TJ
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Factory Lead Time :
- 8 Weeks
- Number of Inputs :
- 600
- JESD-30 Code :
- S-PBGA-B1760
- Number of Outputs :
- 600
- Supply Voltage :
- 0.85V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- HTS Code :
- 8542.39.00.01
- Datasheets
- 5SGXEB5R2F43I2LN
FPGAs Altera (Intel) 5SGXEB5R2F43I2LN Overview
The FPGAs Altera (Intel) 5SGXEB5R2F43I2LN is a state-of-the-art integrated circuit specifically designed for high-performance applications requiring flexible and adaptable hardware configurations. Manufactured by Altera (now part of Intel), this FPGA stands out for its high I/O pin count and its compact 1760FBGA packaging, making it an ideal solution for dense and complex digital environments. This product leverages Intel's leading-edge technology to deliver exceptional speed and functionality, meeting the advanced needs of modern digital systems while ensuring reliability and efficiency in processing.
5SGXEB5R2F43I2LN Features
This integrated circuit boasts a robust array of features, including a substantial 600 I/O pins that facilitate versatile connectivity and integration capabilities. The 1760FBGA package is optimized for improved thermal management and reduced space requirements, which is crucial for high-density electronic assemblies. Additionally, the FPGA utilizes advanced security protocols to protect against intrusions and ensure data integrity, making it a reliable choice for critical applications.
5SGXEB5R2F43I2LN Applications
- Data Centers: Utilized for managing extensive data flows and complex processing tasks, enhancing server capabilities and network reliability.
- Telecommunications: Essential in the deployment of high-speed communication infrastructures, supporting advanced signal processing and data transmission technologies.
- Automotive Systems: Employed in advanced driver-assistance systems (ADAS) to process real-time sensor data, improving vehicle safety and performance.
- Aerospace and Defense: Critical for navigation systems and onboard computers, providing the robust processing power required in challenging environments.
- Consumer Electronics: Integrated into devices such as high-definition televisions and gaming consoles, enhancing user experience through superior graphical processing.
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