5SGXEABN3F45I4N
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- Mfr.Part #
- 5SGXEABN3F45I4N
- Manufacturer
- Altera (Intel)
- Package / Case
- 1932-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 840 I/O 1932FBGA
- Stock
- 40,433
- In Stock ：
- 40,433
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Height Seated (Max) :
- 3.9mm
- JESD-30 Code :
- S-PBGA-B1932
- Terminal Form :
- Ball
- Power Supplies :
- 0.851.52.52.5/31.2/3V
- Number of I/O :
- 840
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Supply Voltage :
- 0.85V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- RoHS Compliant
- Qualification Status :
- Not Qualified
- Length :
- 45mm
- Voltage - Supply :
- 0.82V~0.88V
- Mounting Type :
- Surface Mount
- Series :
- Stratix® V GX
- Number of LABs/CLBs :
- 359200
- Number of Logic Elements/Cells :
- 952000
- HTS Code :
- 8542.39.00.01
- Factory Lead Time :
- 8 Weeks
- Operating Temperature :
- -40°C~100°C TJ
- Surface Mount :
- yes
- Terminal Position :
- BOTTOM
- Package / Case :
- 1932-BBGA, FCBGA
- Total RAM Bits :
- 53248000
- Packaging :
- Tray
- Terminal Pitch :
- 1mm
- Number of Inputs :
- 840
- Base Part Number :
- 5SGXEAB
- Number of Outputs :
- 840
- Width :
- 45mm
- Organization :
- 35920 CLBS
- Datasheets
- 5SGXEABN3F45I4N
FPGAs Altera 5SGXEABN3F45I4N Overview
The FPGAs Altera 5SGXEABN3F45I4N by Intel stands out in the complex field of digital circuit design, offering a sophisticated platform for developing high-performance, adaptable digital systems. This field-programmable gate array (FPGA) is an integral component in critical systems where performance and flexibility cannot be compromised. With its substantial I/O capabilities and a high pin count packaged in a 1932FBGA, this FPGA is ideally suited for handling complex computations and multiple configurations, particularly in data-intensive applications.
5SGXEABN3F45I4N Features
The 5SGXEABN3F45I4N FPGA from Altera (Intel) is built to support high-throughput applications, offering 840 I/O pins which facilitate extensive connectivity and interface options. The high-density ball grid array (BGA) packaging ensures a compact footprint along with superior performance, reliability, and heat dissipation. These features make the 5SGXEABN3F45I4N a preferred choice for developers looking to push the boundaries of technology in their products.
5SGXEABN3F45I4N Applications
- Data Centers: Utilized in server architectures to manage data flow and signal processing efficiently, enhancing overall data center performance.
- Telecommunications: Employs its high I/O capacity in telecom infrastructure to support complex signal processing tasks and connectivity for faster communication networks.
- Automotive: Plays a crucial role in advanced driver-assistance systems (ADAS) by processing multiple inputs from various sensors, helping to improve vehicle safety and functionality.
- Medical Imaging: Used in medical imaging equipment such as MRI and CT scanners to process large data sets quickly and accurately, improving diagnostic capabilities.
- Industrial Automation: Improves control systems in automated manufacturing processes, increasing precision and productivity in factories.
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