5SGXEABN3F45I3L

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Mfr.Part #
5SGXEABN3F45I3L
Manufacturer
Altera (Intel)
Package / Case
1932-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 840 I/O 1932FBGA
Stock
37,564
In Stock :
37,564

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Position :
BOTTOM
RoHS Status :
RoHS Compliant
Surface Mount :
yes
Number of Logic Elements/Cells :
952000
Number of I/O :
840
Operating Temperature :
-40°C~100°C TJ
Terminal Pitch :
1mm
JESD-30 Code :
S-PBGA-B1932
Width :
45mm
Qualification Status :
Not Qualified
Number of Inputs :
840
Supply Voltage :
0.85V
Base Part Number :
5SGXEAB
Terminal Form :
Ball
Organization :
35920 CLBS
Packaging :
Tray
Package / Case :
1932-BBGA, FCBGA
Mounting Type :
Surface Mount
Series :
Stratix® V GX
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
HTS Code :
8542.39.00.01
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Power Supplies :
0.851.52.52.5/31.2/3V
Voltage - Supply :
0.82V~0.88V
Number of Outputs :
840
Length :
45mm
Height Seated (Max) :
3.9mm
Total RAM Bits :
53248000
Factory Lead Time :
8 Weeks
Number of LABs/CLBs :
359200
Datasheets
5SGXEABN3F45I3L
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXEABN3F45I3L from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Base Part Number:5SGXEAB, Package / Case:1932-BBGA, FCBGA, Mounting Type:Surface Mount, 5SGXEABN3F45I3L pinout, 5SGXEABN3F45I3L datasheet PDF, 5SGXEABN3F45I3L amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXEABN3F45I3L ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGXEABN3F45I3L


FPGAs Altera (Intel) 5SGXEABN3F45I3L Overview

The FPGAs Altera (Intel) 5SGXEABN3F45I3L is an advanced integrated circuit designed to meet the high-performance demands of today's complex digital systems. With its large I/O capability and a densely packed 1932FBGA package, this FPGA is perfectly suited for applications that require high-speed data processing and significant logic capacity. The ability to reprogram these devices in the field provides unmatched flexibility in dynamic technology markets, making it an ideal solution for developers looking to future-proof their systems. The integration of such robust features into a single device underscores Intel’s commitment to delivering cutting-edge technology that enhances system reliability and performance.

5SGXEABN3F45I3L Features

This FPGA boasts 840 I/O pins, providing extensive interfacing capabilities, which are essential for complex digital communications and signal processing tasks. The 1932FBGA packaging not only supports a compact design but also enhances thermal performance, crucial for maintaining reliability in high-density chip configurations. This chip's architecture is optimized for high-speed digital applications, ensuring efficient and rapid data handling and processing capabilities.

5SGXEABN3F45I3L Applications

  • Telecommunications Equipment: Utilized in routers and switches, the FPGA enhances data flow management and supports multiple high-speed data streams simultaneously.
  • Data Centers: This device is critical in managing data processing and storage operations, improving the efficiency and scalability of large-scale data centers.
  • Automotive Systems: Applied in advanced driver-assistance systems (ADAS), it supports the processing and integration of multiple sensor data inputs crucial for real-time decision-making.
  • Medical Imaging: The FPGA processes complex imaging algorithms in medical diagnostic equipment, enhancing image clarity and processing speed, essential for accurate diagnostics.
  • Aerospace and Defense: In applications requiring robust, fault-tolerant computing, such as satellite communications and avionics, this FPGA ensures reliable operation under extreme conditions.
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