5SGXEABN3F45C2LN
- Mfr.Part #
- 5SGXEABN3F45C2LN
- Manufacturer
- Altera (Intel)
- Package / Case
- 1932-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 840 I/O 1932FBGA
- Stock
- 48,043
- In Stock :
- 48,043
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Width :
- 45mm
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Total RAM Bits :
- 53248000
- Number of Logic Elements/Cells :
- 952000
- Number of LABs/CLBs :
- 359200
- Series :
- Stratix® V GX
- RoHS Status :
- RoHS Compliant
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Inputs :
- 840
- Organization :
- 35920 CLBS
- Package / Case :
- 1932-BBGA, FCBGA
- Number of Outputs :
- 840
- Terminal Form :
- Ball
- Mounting Type :
- Surface Mount
- Supply Voltage :
- 0.85V
- Number of I/O :
- 840
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- HTS Code :
- 8542.39.00.01
- Power Supplies :
- 0.851.52.52.5/31.2/3V
- Factory Lead Time :
- 8 Weeks
- Height Seated (Max) :
- 3.9mm
- Length :
- 45mm
- Operating Temperature :
- 0°C~85°C TJ
- Voltage - Supply :
- 0.82V~0.88V
- Base Part Number :
- 5SGXEAB
- Surface Mount :
- yes
- JESD-30 Code :
- S-PBGA-B1932
- Packaging :
- Tray
- Qualification Status :
- Not Qualified
- Datasheets
- 5SGXEABN3F45C2LN

FPGAs (Field Programmable Gate Array)+Altera (Intel)+5SGXEABN3F45C2LN Overview
Introducing the FPGAs (Field Programmable Gate Array)+Altera (Intel)+5SGXEABN3F45C2LN, a high-performance integrated circuit designed by Altera (now part of Intel). This FPGA stands out in the market for its exceptional configurability and capacity, tailored for demanding applications that require high-speed data processing and significant logic density. With its 1932FBGA package, this FPGA ensures a robust, scalable platform for developing complex digital circuits, while its 840 I/O pins provide substantial flexibility for interfacing with other components and systems.
5SGXEABN3F45C2LN Features
The 5SGXEABN3F45C2LN FPGA from Altera (Intel) is packed with features designed for efficiency and high performance. Key attributes include its expansive array of 840 I/O pins which facilitate versatile connectivity options. The device's high-density 1932FBGA packaging ensures optimal thermal management and reliability for embedded solutions. Advanced security protocols integrated within the FPGA provide enhanced data protection, making it suitable for sensitive or critical applications.
5SGXEABN3F45C2LN Applications
- Data Centers: Utilized for managing high-speed data operations and storage solutions, enhancing throughput and reliability in server environments.
- Telecommunications: Essential in the deployment of next-generation networking equipment, providing the necessary processing power and connectivity to handle massive data flows and high-speed communications.
- Automotive: Applied in advanced driver-assistance systems (ADAS), enabling rapid processing and integration of sensors and actuators, crucial for real-time decision making.
- Medical Devices: Forms the backbone of critical diagnostic and imaging equipment, ensuring precise and quick processing capabilities that are vital for patient care.
- Industrial Automation: Drives the core of robotics and control systems, facilitating improved efficiency and precision in automated tasks.
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