5SGXEA3H3F35C3N

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Mfr.Part #
5SGXEA3H3F35C3N
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 432 I/O 1152FBGA
Stock
9,214
In Stock :
9,214

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Height Seated (Max) :
3.6mm
Package / Case :
1152-BBGA, FCBGA
ECCN Code :
3A001.A.7.A
Voltage - Supply :
0.82V~0.88V
Terminal Position :
BOTTOM
Mounting Type :
Surface Mount
RoHS Status :
RoHS Compliant
Width :
35mm
Factory Lead Time :
8 Weeks
Length :
35mm
Power Supplies :
0.851.52.52.5/31.2/3V
Series :
Stratix® V GX
Terminal Pitch :
1mm
Number of I/O :
432
Total RAM Bits :
19456000
Number of LABs/CLBs :
128300
Number of Inputs :
432
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Form :
Ball
Supply Voltage :
0.85V
Qualification Status :
Not Qualified
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Outputs :
432
Number of Logic Elements/Cells :
340000
Surface Mount :
yes
HTS Code :
8542.39.00.01
Base Part Number :
5SGXEA3
Organization :
12830 CLBS
Packaging :
Tray
JESD-30 Code :
S-PBGA-B1152
Operating Temperature :
0°C~85°C TJ
Datasheets
5SGXEA3H3F35C3N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXEA3H3F35C3N from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1152-BBGA, FCBGA, Mounting Type:Surface Mount, Base Part Number:5SGXEA3, Operating Temperature:0°C~85°C TJ, 5SGXEA3H3F35C3N pinout, 5SGXEA3H3F35C3N datasheet PDF, 5SGXEA3H3F35C3N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXEA3H3F35C3N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGXEA3H3F35C3N


FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXEA3H3F35C3N Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXEA3H3F35C3N is a high-performance integrated circuit engineered by Intel under its Altera brand. This FPGA is designed to cater to the demands of high-throughput applications, featuring robust I/O capabilities and a compact 1152FBGA package. Its advanced architecture allows for superior customization and scalability, making it an ideal choice for developers looking to harness significant processing power for complex algorithms and multi-functional systems.

5SGXEA3H3F35C3N Features

The 5SGXEA3H3F35C3N FPGA boasts a wide array of features suited for rigorous computing tasks. It includes 432 I/O pins, allowing for extensive connectivity with other components and systems. The device is housed in a 1152-pin FBGA (Fine-pitch Ball Grid Array) package, which ensures a minimal footprint while providing ample pin accessibility for dense circuit designs. This model is part of Intel’s high-end FPGA offerings, providing flexibility and efficiency for hardware acceleration tasks.

5SGXEA3H3F35C3N Applications

  • Data Centers: Utilized in server architectures to accelerate data processing and virtualization tasks, enhancing overall system efficiency and performance.
  • Telecommunications: Integral in the development of telecommunications infrastructure, aiding in signal processing and data transmission enhancements.
  • Automotive Technology: Employs sophisticated FPGA capabilities for advanced driver-assistance systems (ADAS) and in-vehicle networking features.
  • Industrial Automation: Plays a crucial role in control systems and automation, improving operational reliability and speed in manufacturing processes.
  • Medical Devices: Applied in medical imaging systems, such as MRI and ultrasound devices, for faster processing and improved image resolution.
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