5SGSMD3E3H29C4N

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Mfr.Part #
5SGSMD3E3H29C4N
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 780HBGA
Stock
42,258
In Stock :
42,258

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Mounting Type :
Surface Mount
Number of I/O :
360
Base Part Number :
5SGSMD3
RoHS Status :
RoHS Compliant
Surface Mount :
yes
Number of Logic Elements/Cells :
236000
Length :
33mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-30 Code :
S-PBGA-B780
Power Supplies :
0.851.52.52.5/31.2/3V
Terminal Pitch :
1mm
Total RAM Bits :
13312000
Package / Case :
780-BBGA, FCBGA
Height Seated (Max) :
3.6mm
Number of Terminations :
780
Terminal Form :
Ball
Series :
Stratix® V GS
Number of Inputs :
360
Packaging :
Tray
Voltage - Supply :
0.82V~0.88V
Supply Voltage :
0.85V
Operating Temperature :
0°C~85°C TJ
Qualification Status :
Not Qualified
Number of Outputs :
360
Factory Lead Time :
8 Weeks
Organization :
8900 CLBS
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of LABs/CLBs :
89000
Terminal Position :
BOTTOM
Width :
33mm
Datasheets
5SGSMD3E3H29C4N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E3H29C4N from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:5SGSMD3, Package / Case:780-BBGA, FCBGA, Number of Terminations:780, Operating Temperature:0°C~85°C TJ, 5SGSMD3E3H29C4N pinout, 5SGSMD3E3H29C4N datasheet PDF, 5SGSMD3E3H29C4N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E3H29C4N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGSMD3E3H29C4N


FPGAs Altera 5SGSMD3E3H29C4N Overview

The FPGAs Altera 5SGSMD3E3H29C4N, manufactured by Altera (Intel), is a high-performance Integrated Circuit (IC) specifically designed for complex digital computations and versatile applications. This FPGA stands out in the market due to its robust configuration options and high-density integration. Ideal for engineers and developers looking to push the boundaries of technology, the 5SGSMD3E3H29C4N provides a flexible and efficient platform for developing advanced digital products. The FPGA's architecture enables rapid prototyping and mass production capabilities, making it a top choice for industries requiring high-speed data processing and significant logic density.

5SGSMD3E3H29C4N Features

The 5SGSMD3E3H29C4N features 360 programmable I/O pins housed in a 780-pin HBGA (Heat-Spread Ball Grid Array) package, offering extensive connectivity and superior heat management. This FPGA supports various logic integration solutions, optimized for power efficiency and high-speed performance. Its reprogrammable nature allows for multiple applications without the need for extensive retooling, providing a cost-effective solution for both prototyping and large-scale deployments.

5SGSMD3E3H29C4N Applications

  • Telecommunications: Utilized in routers and switches for packet processing, the 5SGSMD3E3H29C4N enhances bandwidth management and data flow efficiency.
  • Automotive: Plays a critical role in advanced driver-assistance systems (ADAS) by processing real-time sensor data and supporting the integration of safety features.
  • Medical Imaging: Used in medical diagnostic equipment such as MRI and CT scanners, providing the necessary computational power to handle complex imaging algorithms.
  • Data Centers: Serves as the backbone for server load balancing and complex data processing tasks, improving overall efficiency and response times in cloud services.
  • Consumer Electronics: Integrated into devices such as high-definition televisions and gaming consoles, enhancing visual output and user interaction.
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