5SGSMD3E1H29C1N

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Mfr.Part #
5SGSMD3E1H29C1N
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 780HBGA
Stock
3,946
In Stock :
3,946

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Outputs :
360
Total RAM Bits :
13312000
Power Supplies :
0.91.52.52.5/31.2/3V
Factory Lead Time :
8 Weeks
Package / Case :
780-BBGA, FCBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-30 Code :
S-PBGA-B780
Number of Logic Elements/Cells :
236000
Mounting Type :
Surface Mount
Operating Temperature :
0°C~85°C TJ
RoHS Status :
RoHS Compliant
Packaging :
Tray
Number of Terminations :
780
Series :
Stratix® V GS
Qualification Status :
Not Qualified
Length :
33mm
Base Part Number :
5SGSMD3
Number of I/O :
360
Number of LABs/CLBs :
89000
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Inputs :
360
Surface Mount :
yes
Width :
33mm
Height Seated (Max) :
3.6mm
Terminal Position :
BOTTOM
HTS Code :
8542.39.00.01
Terminal Pitch :
1mm
Terminal Form :
Ball
Voltage - Supply :
0.87V~0.93V
Supply Voltage :
0.9V
Organization :
8900 CLBS
Datasheets
5SGSMD3E1H29C1N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E1H29C1N from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:780-BBGA, FCBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Terminations:780, Base Part Number:5SGSMD3, 5SGSMD3E1H29C1N pinout, 5SGSMD3E1H29C1N datasheet PDF, 5SGSMD3E1H29C1N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGSMD3E1H29C1N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGSMD3E1H29C1N


FPGAs Altera 5SGSMD3E1H29C1N Overview

The FPGAs Altera 5SGSMD3E1H29C1N, manufactured by Altera (Intel), is a high-performance integrated circuit specifically designed to meet the complex and demanding requirements of modern digital systems. As an FPGA (Field Programmable Gate Array), this product offers immense flexibility and adaptability, allowing it to be programmed and reprogrammed to suit a wide range of applications. The 5SGSMD3E1H29C1N is housed in a 780HBGA package, providing robust connectivity and compatibility, and is equipped with 360 I/O pins that facilitate versatile and efficient interfacing with other components in a system.

5SGSMD3E1H29C1N Features

This FPGA boasts several distinctive features that make it an ideal choice for developers and engineers looking to leverage advanced digital technologies. Key attributes include its extensive I/O capabilities, allowing for high-speed data transfer and interfacing with multiple peripherals simultaneously. The compact 780HBGA packaging ensures a minimal footprint while maintaining high performance and reliability under various operating conditions. Moreover, the ability to reconfigure the device post-deployment offers significant advantages in terms of product lifecycle and adaptability to evolving technological needs.

5SGSMD3E1H29C1N Applications

  • Telecommunications: Utilized in communication infrastructure, the FPGA enhances processing capabilities in routers and switches, ensuring efficient data flow and high-speed connectivity.
  • Automotive: Integrated into driver assistance systems, this FPGA processes multiple sensor data streams simultaneously, improving vehicle safety and performance.
  • Industrial: In manufacturing settings, the 5SGSMD3E1H29C1N is essential for controlling machinery and automation systems, increasing precision and reducing downtime.
  • Consumer Electronics: Used in devices such as high-definition televisions and gaming consoles, the FPGA supports advanced graphics processing and real-time user interface enhancements.
  • Medical Devices: Applies in medical imaging equipment, where it processes complex imaging data, aiding in faster and more accurate diagnostics.
This HTML content incorporates a structured approach to describe the FPGA product comprehensively, emphasizing its flexibility, features, and potential applications across various industries.
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