5AGZME5H2F35C3N

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Mfr.Part #
5AGZME5H2F35C3N
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 534 I/O 1152FBGA
Stock
35,007
In Stock :
35,007

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Width :
35mm
Voltage - Supply :
0.82V~0.88V
Peak Reflow Temperature (Cel) :
245
JESD-30 Code :
S-PBGA-B1152
Terminal Position :
BOTTOM
Base Part Number :
5AGZME5
Packaging :
Tray
Operating Temperature :
0°C~85°C TJ
Package / Case :
1152-BBGA, FCBGA
Total RAM Bits :
34322432
ECCN Code :
3A001.A.7.A
Factory Lead Time :
8 Weeks
Height Seated (Max) :
3.6mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells :
400000
Mounting Type :
Surface Mount
Terminal Finish :
TIN SILVER COPPER
Number of I/O :
534
Surface Mount :
yes
RoHS Status :
RoHS Compliant
Supply Voltage :
0.85V
HTS Code :
8542.39.00.01
Series :
Arria V GZ
Time@Peak Reflow Temperature-Max (s) :
40
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of LABs/CLBs :
18870
JESD-609 Code :
e1
Terminal Pitch :
1mm
Length :
35mm
Datasheets
5AGZME5H2F35C3N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5AGZME5H2F35C3N from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:5AGZME5, Operating Temperature:0°C~85°C TJ, Package / Case:1152-BBGA, FCBGA, Mounting Type:Surface Mount, 5AGZME5H2F35C3N pinout, 5AGZME5H2F35C3N datasheet PDF, 5AGZME5H2F35C3N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5AGZME5H2F35C3N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5AGZME5H2F35C3N


FPGAs (Field Programmable Gate Array) Altera (Intel) 5AGZME5H2F35C3N Overview

Introducing the FPGAs (Field Programmable Gate Array) Altera (Intel) 5AGZME5H2F35C3N, a state-of-the-art integrated circuit developed by Altera, now part of Intel’s distinguished technology portfolio. This IC FPGA (Integrated Circuit Field Programmable Gate Array) is meticulously engineered to cater to high-performance applications requiring high-speed data processing and configurable functionalities. Housed in a compact 1152FBGA (Fine Pitch Ball Grid Array) package, it supports a wide array of digital and analog functionalities in various technological environments. Its robust I/O interface, with 534 configurable I/O pins, ensures versatile connectivity and integration capabilities, making it an ideal choice for developers looking to harness the power of FPGA technology for sophisticated designs and innovations.

5AGZME5H2F35C3N Features

The 5AGZME5H2F35C3N FPGA offers an array of features suitable for demanding applications. Key features include a high-density integration which allows for substantial logic functions in a single chip, enhancing both performance and reliability. The device’s flexibility in re-programming allows for updates and functionality changes post-deployment, ensuring adaptability to new technologies and standards. Additionally, the high count of I/O pins provides extensive interface capabilities, enabling complex board designs with multiple input and output options.

5AGZME5H2F35C3N Applications

  • Data Centers: Utilized for managing data flow and processing tasks, improving efficiency and speed in server applications.
  • Telecommunications: Plays a crucial role in signal processing, supporting infrastructure for both wired and wireless communication networks.
  • Automotive: Applied in driver assistance systems, providing necessary computation and logic for safety features.
  • Medical Devices: Used in medical imaging systems, enhancing processing capabilities for complex imaging technologies like MRI and ultrasound.
  • Industrial Automation: Essential in control systems for manufacturing processes, increasing precision and operational efficiency.
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