44-6554-10
- Mfr.Part #
- 44-6554-10
- Manufacturer
- Aries Electronics, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN IC DIP SOCKET ZIF 44POS TIN
- Stock
- 36,735
- In Stock :
- 36,735
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- Manufacturer :
- Aries Electronics, Inc.
- Product Category :
- IC Sockets
- Dielectric Withstanding Voltage :
- 1000VAC V
- Packaging :
- Bulk
- ECCN Code :
- EAR99
- PCB Contact Row Spacing :
- 0.6 mm
- PCB Contact Pattern :
- RECTANGULAR
- Termination Post Length :
- 0.110 2.78mm
- Insulation Resistance :
- 1000000000Ohm
- Number of Contacts :
- 44
- Pitch - Mating :
- 0.100 2.54mm
- Mating Contact Pitch :
- 0.1 inch
- Number of Rows :
- 2
- Current Rating :
- 1A
- Contact Style :
- BELLOWED TYPE
- Flammability Rating :
- UL94 V-0
- JESD-609 Code :
- e3
- Published :
- 2013
- Lead Pitch :
- 2.54mm
- Pbfree Code :
- yes
- Mounting Type :
- Through Hole
- Material Flammability Rating :
- UL94 V-0
- Number of Positions :
- 44
- Feature :
- Closed Frame
- Contact Finish Thickness - Mating :
- 200.0μin 5.08μm
- RoHS Status :
- ROHS3 Compliant
- Pitch - Post :
- 0.100 2.54mm
- Factory Lead Time :
- 4 Weeks
- Body Breadth :
- 0.9 inch
- Mount :
- Through Hole
- Termination :
- Solder
- Additional Feature :
- STANDARD: UL 94V-0
- Contact Material - Mating :
- BERYLLIUM COPPER
- Operating Temperature (Max) :
- 105°C
- Contact Finish Thickness - Post :
- 200.0μin 5.08μm
- Number of Positions or Pins (Grid) :
- 44 (2 x 22)
- Lead Length :
- 2.794mm
- Series :
- 55
- Body Depth :
- 0.47 inch
- Contact Material - Post :
- BERYLLIUM COPPER
- Contact Finish - Mating :
- Tin
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Type :
- DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing
- Housing Material :
- Polyphenylene Sulfide (PPS), Glass Filled
- Datasheets
- 44-6554-10
44-6554-10 datasheet pdf and Sockets for ICs, Transistors product details from Aries Electronics stock available at Xinshop
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