28-6574-10
- Mfr.Part #
- 28-6574-10
- Manufacturer
- Aries Electronics, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN IC DIP SOCKET ZIF 28POS TIN
- Stock
- 2
- In Stock :
- 2
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- Manufacturer :
- Aries Electronics, Inc.
- Product Category :
- IC Sockets
- Pitch - Mating :
- 0.100 2.54mm
- Pbfree Code :
- yes
- Pitch - Post :
- 0.100 2.54mm
- Housing Material :
- Polyphenylene Sulfide (PPS), Glass Filled
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Current Rating (Amps) :
- 1A
- Body Breadth :
- 0.9 inch
- ECCN Code :
- EAR99
- RoHS Status :
- ROHS3 Compliant
- Terminal Pitch :
- 2.54mm
- Height :
- 11.9mm
- Termination Post Length :
- 0.110 2.78mm
- Type :
- DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing
- Contact Finish - Mating :
- Tin
- Termination :
- Solder
- Mounting Type :
- Through Hole
- Series :
- 57
- Lead Free :
- Lead Free
- Operating Temperature (Max) :
- 105°C
- Contact Material :
- Copper
- Published :
- 2008
- Additional Feature :
- STANDARD: UL 94V-0
- REACH SVHC :
- No SVHC
- Factory Lead Time :
- 5 Weeks
- Feature :
- Closed Frame
- Mating Contact Pitch :
- 0.1 inch
- Number of Positions :
- 28
- Contact Style :
- SQ PIN-SKT
- Contact Finish Thickness - Post :
- 200.0μin 5.08μm
- Contact Finish Thickness - Mating :
- 200.0μin 5.08μm
- JESD-609 Code :
- e3
- Contact Material - Post :
- BERYLLIUM COPPER
- Body Depth :
- 0.47 inch
- Material Flammability Rating :
- UL94 V-0
- PCB Contact Pattern :
- RECTANGULAR
- Number of Positions or Pins (Grid) :
- 28 (2 x 14)
- Number of Contacts :
- 28
- Contact Material - Mating :
- BERYLLIUM COPPER
- Insulation Resistance :
- 1000000000Ohm
- Length :
- 50.5mm
- Row Spacing :
- 15.24 mm
- Width :
- 22.9mm
- Connector Type :
- DIP
- Mount :
- Through Hole
- Dielectric Withstanding Voltage :
- 1000VAC V
- Packaging :
- Bulk
- Datasheets
- 28-6574-10
28-6574-10 Documents

28-6574-10 datasheet pdf and Sockets for ICs, Transistors product details from Aries Electronics stock available at Xinshop
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