25LC010AT-E/MC

Manufacturer :

Microchip Technology

Product Category :

Memory

Lead Free :

Lead Free

Serial Bus Type :

SPI

Memory Density :

1024 bit

Product Category :

EEPROM

Write Protection :

HARDWARE/SOFTWARE

Product Type :

EEPROM

Programming Voltage :

3.3 V, 5 V

Operating Supply Voltage :

5V

Supply Voltage :

5V

Memory Type :

Non-Volatile

Standby Current-Max :

0.000001A

Memory Width :

8

Power Supplies :

3/5 V

Access Time :

100 ns

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Endurance :

1000000 Write/Erase Cycles

Qualification Status :

Not Qualified

JESD-609 Code :

e3

Write Cycle Time-Max (tWC) :

5ms

Density :

1 kb

Interface Type :

SPI

Pin Count :

8

Memory Organization :

128 x 8

Pbfree Code :

yes

Number of Pins :

8

Mounting Style :

SMD/SMT

Base Product Number :

25LC010

ECCN Code :

EAR99

Clock Frequency :

10MHz

Memory IC Type :

EEPROM

Package Shape :

RECTANGULAR

Nominal Supply Current :

5mA

Number of Functions :

1

Terminal Position :

Dual

RoHS :

Details

Brand :

Microchip Technology

Operating Temperature :

-40°C~125°C TA

Supply Voltage-Min (Vsup) :

2.5 V

Data Retention :

200 Year

Supply Voltage-Max (Vsup) :

5.5 V

Maximum Operating Temperature :

+ 125 C

Subcategory :

Memory and Data Storage

Mounting Type :

Surface Mount

JESD-30 Code :

R-PDSO-N8

Packaging :

Tape and Reel (TR)

Product Status :

Active

RoHS Status :

ROHS3 Compliant

Height Seated (Max) :

1mm

Memory Format :

EEPROM

Height :

0.95 mm (Max)

Additional Feature :

DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES

Package :

Tape and Reel (TR)

Write Cycle Time - Word, Page :

5ms

Series :

--

Number of Words :

128 words

Parallel/Serial :

Serial

Manufacturer :

Microchip

Interface :

SPI, Serial

Mount :

Surface Mount

Terminal Pitch :

0.5mm

Minimum Operating Temperature :

- 40 C

Seated Height-Max :

1 mm

Radiation Hardening :

No

Terminal Finish :

Matte Tin (Sn)

Terminal Form :

NO LEAD

Data Retention Time-Min :

200

Reach Compliance Code :

Compliant

Organization :

128 x 8

Peak Reflow Temperature (Cel) :

260

Supplier Device Package :

8-DFN (2x3)

Published :

2012

Voltage - Supply :

2.5V~5.5V

Base Part Number :

25LC010A

Memory Interface :

SPI

Width :

2mm

Temperature Grade :

Automotive

Surface Mount :

yes

Time@Peak Reflow Temperature-Max (s) :

40

Length :

3mm

Package / Case :

8-VFDFN Exposed Pad

Number of Terminations :

8

HTS Code :

8542.32.00.51

Factory Lead Time :

7 Weeks

Supply Current-Max :

0.005 mA

Number of Terminals :

8

Operating Mode :

SYNCHRONOUS

Memory Size :

1Kb 128 x 8