1ST280EY2F55I2LG

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Mfr.Part #
1ST280EY2F55I2LG
Manufacturer
Altera (Intel)
Package / Case
2912-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 296 I/O 2912BGA
Stock
31,540
In Stock :
31,540

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
0.82V~0.88V
Series :
Stratix® 10 TX
Factory Lead Time :
12 Weeks
Number of LABs/CLBs :
350000
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Operating Temperature :
-40°C~100°C TJ
Package / Case :
2912-BBGA, FCBGA
Number of I/O :
296
Number of Logic Elements/Cells :
2800000
Datasheets
1ST280EY2F55I2LG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 1ST280EY2F55I2LG from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Package / Case:2912-BBGA, FCBGA, 1ST280EY2F55I2LG pinout, 1ST280EY2F55I2LG datasheet PDF, 1ST280EY2F55I2LG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 1ST280EY2F55I2LG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 1ST280EY2F55I2LG


FPGAs Altera (Intel) 1ST280EY2F55I2LG Overview

The FPGAs Altera (Intel) 1ST280EY2F55I2LG is a high-performance integrated circuit designed for the most demanding applications. Manufactured by Altera (now part of Intel), this FPGA stands out in the market for its robust feature set, including a substantial number of I/Os and a compact 2912 BGA package. This product targets developers and industries looking for superior programmability and efficiency, providing a versatile solution that enhances system performance while reducing total power consumption. The integration capabilities and scalability of the 1ST280EY2F55I2LG make it an excellent choice for customers aiming to innovate and lead in their respective markets.

1ST280EY2F55I2LG Features

  • High I/O count: Includes 296 programmable I/O ports, allowing for versatile connection and interface options.
  • Compact BGA packaging: Utilizes a 2912-ball grid array package that enables a dense and efficient layout on the PCB.
  • Advanced Intel technology: Benefits from the leading-edge processes and technology optimizations provided by Intel, ensuring high-speed performance and reliability.

1ST280EY2F55I2LG Applications

  • Telecommunications Equipment: Utilized in routers and switches to manage data traffic efficiently.
  • Automotive Electronics: Integral in advanced driver-assistance systems (ADAS) for processing and decision-making.
  • Consumer Electronics: Used in high-definition multimedia interfaces (HDMI) and virtual reality devices to handle complex computations.
  • Industrial Automation: Serves as the control hub in robotic systems, optimizing operations and increasing productivity.
  • Medical Devices: Implements critical tasks in imaging systems like MRI and ultrasound scanners, ensuring precise and reliable diagnostics.
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