1SG280HH3F55E3XG

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Mfr.Part #
1SG280HH3F55E3XG
Manufacturer
Altera (Intel)
Package / Case
2912-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 1160 I/O 2912BGA
Stock
19,429
In Stock :
19,429

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Reach Compliance Code :
Compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells :
2800000
Number of I/O :
1160
Mounting Type :
Surface Mount
Voltage - Supply :
0.82V~0.88V
Package / Case :
2912-BBGA, FCBGA
Series :
Stratix® 10 GX
Number of LABs/CLBs :
350000
Operating Temperature :
0°C~100°C TJ
Factory Lead Time :
12 Weeks
Datasheets
1SG280HH3F55E3XG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 1SG280HH3F55E3XG from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:2912-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, 1SG280HH3F55E3XG pinout, 1SG280HH3F55E3XG datasheet PDF, 1SG280HH3F55E3XG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 1SG280HH3F55E3XG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 1SG280HH3F55E3XG


FPGAs Altera (Intel) 1SG280HH3F55E3XG Overview

The FPGAs Altera (Intel) 1SG280HH3F55E3XG IC represents a pinnacle of flexible and high-density integration designed to meet the rigorous demands of modern digital systems. Manufactured by Intel under the Altera brand, this FPGA is equipped with 1160 I/Os and packaged in a 2912-pin BGA. This product is engineered for applications requiring significant logic density and I/O versatility, making it an ideal solution for advanced digital processing tasks. Its robust configuration capabilities allow it to adapt to varied and complex digital computations, ensuring efficient performance and high reliability in critical applications.

1SG280HH3F55E3XG Features

This FPGA boasts high integration, featuring 1160 I/O pins that facilitate extensive connectivity with other components in a system. The 2912 BGA package ensures a compact footprint while allowing for efficient heat dissipation, critical in high-performance environments. This model leverages Intel's advanced technology, ensuring superior speed and power efficiency, making it suitable for demanding applications across various sectors.

1SG280HH3F55E3XG Applications

  • Telecommunications: Utilized in routing and switching solutions to manage data traffic efficiently, ensuring high-speed data transmission and robust network reliability.
  • Data Centers: Acts as a core component in data processing units, handling complex algorithms for data storage and retrieval operations, enhancing server efficiency and reliability.
  • Aerospace: Used in navigation and control systems, offering the necessary computational power and reliability required in harsh environments.
  • Automotive: Integral in advanced driver-assistance systems (ADAS), supporting functionalities like sensor data processing and real-time decision making for enhanced vehicle safety.
  • Industrial Automation: Drives automation in manufacturing processes, from robotics control to monitoring systems, increasing productivity and operational accuracy.
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