1SG280HH2F55E1VGS3

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Mfr.Part #
1SG280HH2F55E1VGS3
Manufacturer
Altera (Intel)
Package / Case
2912-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 1160 I/O 2912BGA
Stock
10,873
In Stock :
10,873

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of I/O :
1160
Mounting Type :
Surface Mount
Series :
Stratix® 10 GX
Package / Case :
2912-BBGA, FCBGA
Number of LABs/CLBs :
350000
Operating Temperature :
0°C~100°C TJ
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Logic Elements/Cells :
2800000
Voltage - Supply :
0.77V~0.97V
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 1SG280HH2F55E1VGS3 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:2912-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, 1SG280HH2F55E1VGS3 pinout, 1SG280HH2F55E1VGS3 datasheet PDF, 1SG280HH2F55E1VGS3 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 1SG280HH2F55E1VGS3 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 1SG280HH2F55E1VGS3


FPGAs Altera 1SG280HH2F55E1VGS3 Overview

The FPGAs Altera 1SG280HH2F55E1VGS3 by Intel represents a significant leap in the field of programmable logic devices, combining advanced technology with high functionality to meet the evolving demands of modern applications. This integrated circuit is housed in a 2912-pin BGA package and is designed to offer exceptional performance and flexibility with its vast I/O capabilities, featuring 1160 I/O pins. The device's architecture is tailored to accelerate project timelines and reduce development costs, making it an ideal solution for designers looking to optimize their high-speed computing tasks and data-intensive applications. The use of the FPGAs Altera 1SG280HH2F55E1VGS3 enhances system reliability and scalability in complex digital environments.

1SG280HH2F55E1VGS3 Features

The 1SG280HH2F55E1VGS3 FPGA is packed with features that make it highly suitable for a range of demanding applications. Key features include a robust design that supports extensive I/O operations, a high-density grid array package that ensures efficient space utilization and heat dissipation, and enhanced programmability that allows for rapid deployment of custom hardware logic. Additionally, the device supports various logic synthesis tools and software, facilitating easier integration and scalability in complex projects.

1SG280HH2F55E1VGS3 Applications

  • Data Centers: Utilized in managing vast data flows and optimizing storage and retrieval processes, enhancing operational efficiency and reliability in data-intensive environments.
  • Telecommunications: Employs its high I/O capacity for processing large volumes of data and signals, crucial for network infrastructure, signal processing, and real-time communication systems.
  • Automotive: Integrated into driver assistance systems, handling sensor data and supporting safety-critical functionalities, thus playing a crucial role in automotive safety and automation.
  • Industrial Automation: Key to managing and controlling machinery and production lines, ensuring precision and adaptability in real-time monitoring and control systems.
  • Aerospace: Critical for navigation and control systems, where high reliability and performance are mandatory for system integrity and safety.
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