1SG280HH1F55E2LG

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Mfr.Part #
1SG280HH1F55E2LG
Manufacturer
Altera (Intel)
Package / Case
2912-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 1160 I/O 2912BGA
Stock
33,662
In Stock :
33,662

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
0.82V~0.88V
Operating Temperature :
0°C~100°C TJ
Series :
Stratix® 10 GX
Number of I/O :
1160
Number of Logic Elements/Cells :
2800000
Number of LABs/CLBs :
350000
Package / Case :
2912-BBGA, FCBGA
Factory Lead Time :
12 Weeks
Datasheets
1SG280HH1F55E2LG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 1SG280HH1F55E2LG from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, Package / Case:2912-BBGA, FCBGA, 1SG280HH1F55E2LG pinout, 1SG280HH1F55E2LG datasheet PDF, 1SG280HH1F55E2LG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 1SG280HH1F55E2LG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 1SG280HH1F55E2LG


FPGAs Altera (Intel) 1SG280HH1F55E2LG Overview

The FPGAs Altera (Intel) 1SG280HH1F55E2LG represents a leading-edge field-programmable gate array designed to deliver high performance and adaptability for a multitude of complex digital systems. With its 1160 I/O pins housed in a compact 2912-ball grid array (BGA) package, this FPGA facilitates robust interfacing and integration capabilities, ideal for advanced system-on-chip (SoC) applications. Leveraging Intel's state-of-the-art technology, the 1SG280HH1F55E2LG ensures optimal performance for high-speed data processing and real-time computing tasks, making it a premier choice for developers looking to push the boundaries of digital innovation.

1SG280HH1F55E2LG Features

  • High I/O Pin Count: Features 1160 input/output pins for flexible connectivity.
  • Advanced BGA Packaging: Utilizes a 2912-ball grid array format that supports high-density integration on compact board designs.
  • High Integration Capability: Ideal for complex digital systems requiring numerous integrated functions on a single chip.

1SG280HH1F55E2LG Applications

  • Telecommunications Equipment: Utilized in routers and switches for enhanced data processing and traffic management.
  • Data Center Infrastructure: Powers servers and storage systems, optimizing data throughput and reliability in cloud services.
  • Automotive Electronics: Integral to advanced driver-assistance systems (ADAS), providing processing power for sensor data and real-time decision making.
  • Medical Devices: Used in medical imaging systems, ensuring high-speed data processing capabilities for real-time diagnostics.
  • Industrial Automation: Drives control systems in manufacturing environments, enhancing operational efficiency and machine-to-machine communication.
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