1SG280HH1F55E1VGS3

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Mfr.Part #
1SG280HH1F55E1VGS3
Manufacturer
Altera (Intel)
Package / Case
2912-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 1160 I/O 2912BGA
Stock
28,666
In Stock :
28,666

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of I/O :
1160
Mounting Type :
Surface Mount
Series :
Stratix® 10 GX
Number of LABs/CLBs :
350000
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
0°C~100°C TJ
Voltage - Supply :
0.77V~0.97V
Number of Logic Elements/Cells :
2800000
Package / Case :
2912-BBGA, FCBGA
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 1SG280HH1F55E1VGS3 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, Package / Case:2912-BBGA, FCBGA, 1SG280HH1F55E1VGS3 pinout, 1SG280HH1F55E1VGS3 datasheet PDF, 1SG280HH1F55E1VGS3 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 1SG280HH1F55E1VGS3 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 1SG280HH1F55E1VGS3


FPGAs Altera 1SG280HH1F55E1VGS3 Overview

The FPGAs Altera 1SG280HH1F55E1VGS3, engineered by Intel, stands out as a highly versatile and powerful field-programmable gate array (FPGA). This product is designed to meet the demanding requirements of modern digital circuits with its substantial logic integration capabilities. It supports a wide array of applications from advanced computing to high-speed networking solutions, underscoring its adaptability in various technological landscapes. With its 1160 I/O pins housed in a 2912 ball grid array (BGA) package, this FPGA facilitates robust and flexible hardware interface options, making it an excellent choice for developers looking to push the boundaries of hardware acceleration and signal processing.

1SG280HH1F55E1VGS3 Features

This FPGA from Altera (Intel) features an impressive configuration that supports extensive design flexibility and scalability. Key features include a high I/O pin count, a compact 2912BGA packaging, and advanced security protocols to ensure safe data handling and operation continuity in critical applications. Its high-performance logic cells enhance computation capabilities, allowing for efficient parallel processing and a reduction in system latency. The device also supports multiple programming environments, facilitating ease of integration into existing technology infrastructures.

1SG280HH1F55E1VGS3 Applications

  • Telecommunications: Utilized in routers and switches for signal integrity and data flow management, improving overall network efficiency.
  • Data Centers: Applied in server architecture to accelerate data processing and storage management, enhancing data retrieval and computational speed.
  • Automotive: Used in driver assistance systems (ADAS) to process real-time sensor data, aiding in the development of safer, more autonomous vehicles.
  • Medical Devices: Integrated in medical imaging equipment such as MRI and ultrasound machines, ensuring high-speed data processing and real-time imaging capabilities.
  • Industrial Automation: Employs in controlling machinery and process automation systems, offering precise control and operational efficiency.
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