1SG250HH3F55E3VG

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Mfr.Part #
1SG250HH3F55E3VG
Manufacturer
Altera (Intel)
Package / Case
2912-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 1160 I/O 2912BGA
Stock
24,575
In Stock :
24,575

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
312500
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Series :
Stratix® 10 GX
Mounting Type :
Surface Mount
Number of I/O :
1160
Voltage - Supply :
0.77V~0.97V
Package / Case :
2912-BBGA, FCBGA
Reach Compliance Code :
Compliant
Operating Temperature :
0°C~100°C TJ
Number of Logic Elements/Cells :
2500000
Factory Lead Time :
12 Weeks
Datasheets
1SG250HH3F55E3VG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 1SG250HH3F55E3VG from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:2912-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, 1SG250HH3F55E3VG pinout, 1SG250HH3F55E3VG datasheet PDF, 1SG250HH3F55E3VG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 1SG250HH3F55E3VG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 1SG250HH3F55E3VG


FPGAs Altera (Intel) 1SG250HH3F55E3VG Overview

The FPGAs Altera (Intel) 1SG250HH3F55E3VG integrates advanced engineering with high functionality to meet the rigorous demands of modern digital circuits. Manufactured by Altera, now part of Intel, this FPGA (Field Programmable Gate Array) showcases exceptional versatility with a design tailored for high-performance applications requiring dense logic and high I/O bandwidth. With its substantial logic elements and adaptability, this device ensures reliable performance in complex electronic environments, making it a preferred choice for innovators and developers looking to push the boundaries of technology.

1SG250HH3F55E3VG Features

This high-performance FPGA offers a variety of features that make it ideal for a wide range of applications. Key attributes include a substantial array of 1160 I/O pins, housed in a compact 2912-ball grid array (BGA) package, providing ample flexibility for interfacing with other components. The 1SG250HH3F55E3VG supports high-speed transceiver data rates and sophisticated power management technology, ensuring efficient operation under varying load conditions and design requirements.

1SG250HH3F55E3VG Applications

  • Data Centers: Utilized in server farms for accelerating data processing tasks, the 1SG250HH3F55E3VG enhances performance by handling large volumes of data swiftly and efficiently.
  • Telecommunications: In telecom infrastructure, this FPGA aids in signal processing, supporting advanced communication protocols and high-speed data transfers.
  • Automotive: Used in driver assistance systems, the FPGA processes inputs from multiple sensors to provide real-time responses, crucial for safety-critical applications.
  • Industrial Automation: This device orchestrates complex control systems in automated manufacturing lines, optimizing operational efficiency and reliability.
  • Medical Devices: Applied in medical imaging systems, the 1SG250HH3F55E3VG FPGA processes complex imaging data, contributing to faster and more accurate diagnostics.
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