1SG250HH1F55E1VG

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Mfr.Part #
1SG250HH1F55E1VG
Manufacturer
Altera (Intel)
Package / Case
2912-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 1160 I/O 2912BGA
Stock
13,211
In Stock :
13,211

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Reach Compliance Code :
Compliant
Voltage - Supply :
0.77V~0.97V
Number of Logic Elements/Cells :
2500000
Series :
Stratix® 10 GX
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
1160
Mounting Type :
Surface Mount
Number of LABs/CLBs :
312500
Factory Lead Time :
12 Weeks
Operating Temperature :
0°C~100°C TJ
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Package / Case :
2912-BBGA, FCBGA
Datasheets
1SG250HH1F55E1VG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 1SG250HH1F55E1VG from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, Package / Case:2912-BBGA, FCBGA, 1SG250HH1F55E1VG pinout, 1SG250HH1F55E1VG datasheet PDF, 1SG250HH1F55E1VG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 1SG250HH1F55E1VG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 1SG250HH1F55E1VG


FPGAs (Field Programmable Gate Array) Altera (Intel) 1SG250HH1F55E1VG Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) 1SG250HH1F55E1VG is designed for advanced system-level integration. This high-performance integrated circuit from Intel's Altera division boasts an impressive array of features suitable for handling complex digital computations. With its 2912-pin ball grid array (BGA) packaging, it ensures robust and reliable connectivity, ideal for high-density applications. The IC's versatility in FPGA technology allows it to be customized post-production, catering to a wide range of applications while providing cost efficiency and reduced development times for enterprise-scale solutions.

1SG250HH1F55E1VG Features

This FPGA device comes equipped with 1160 I/O pins, offering extensive interfacing capabilities. The high I/O count is crucial for applications requiring numerous simultaneous connections, such as multi-functional peripheral devices or high-speed communication channels. Its BGA package promotes better electrical conductivity and heat distribution, ensuring optimal performance under demanding conditions. Additionally, the product's integration with Intel's technology provides superior logic element utilization, making it an ideal choice for developers looking to maximize hardware acceleration.

1SG250HH1F55E1VG Applications

  • Data Centers: Utilized for managing extensive data flows and accelerating network operations, enhancing server capabilities and efficiency.
  • Telecommunications: Critical in handling high-speed signal processing tasks required in modern telecom infrastructure for both wired and wireless communication systems.
  • Automotive Technology: Implements advanced driver-assistance systems (ADAS) by processing multiple real-time inputs from vehicle sensors, improving safety and performance.
  • Medical Devices: Plays a pivotal role in diagnostic and imaging equipment, enabling fast processing of complex biomedical data to assist in timely and accurate medical diagnostics.
  • Consumer Electronics: Used in smart home devices and entertainment systems to handle multiple user inputs and outputs, providing a seamless user experience.
This HTML content incorporates strategic use of headers and detailed descriptions to ensure clarity and enhanced readability, targeting B2B customers interested in high-quality FPGA solutions.
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