1N6109AUS

Manufacturer :

Microchip Technology

Product Category :

Power Dissipation-Max :

2W

Terminal Finish :

TIN LEAD

Factory Lead Time :

17 Weeks

Power Line Protection :

No

Peak Pulse Power :

500W

Contact Plating :

Lead, Tin

Leakage Current :

20μA

Peak Pulse Current :

27.5A

Number of Elements :

1

Operating Temperature :

-55°C~175°C TJ

Current - Peak Pulse (10/1000μs) :

27.5A

Mount :

Surface Mount

ECCN Code :

EAR99

Polarity :

Bidirectional

Terminal Position :

END

Terminal Form :

WRAP AROUND

Published :

1997

JESD-609 Code :

e0

Element Configuration :

Single

Type :

Zener

Applications :

GENERAL PURPOSE

Radiation Hardening :

yes

Direction :

Bidirectional

RoHS Status :

Non-RoHS Compliant

Reverse Standoff Voltage :

9.9V

Max Reverse Leakage Current :

20μA

Test Current :

100mA

Number of Terminations :

2

Package / Case :

SQ-MELF, B

Diode Element Material :

SILICON

Packaging :

Bulk

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Mounting Type :

Surface Mount

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Clamping Voltage :

18.2V

Reverse Breakdown Voltage :

12.35V

Number of Pins :

2

Case Connection :

Isolated

Pin Count :

2

Voltage - Reverse Standoff (Typ) :

9.9V

Pbfree Code :

No

Additional Feature :

High Reliability