1N6109

Manufacturer :

Microchip Technology

Product Category :

Leakage Current :

20μA

Pin Count :

2

Additional Feature :

High Reliability

Polarity :

Bidirectional

Terminal Finish :

TIN LEAD

Diode Element Material :

SILICON

Radiation Hardening :

yes

Power Line Protection :

No

Case Connection :

Isolated

Terminal Form :

WRAP AROUND

Operating Temperature :

-55°C~175°C TJ

Pbfree Code :

No

Contact Plating :

Lead, Tin

Number of Pins :

2

Max Reverse Leakage Current :

20μA

Reverse Breakdown Voltage :

12.35V

Type :

Zener

Number of Terminations :

2

JESD-609 Code :

e0

Test Current :

100mA

Packaging :

Bulk

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Mount :

Surface Mount

Terminal Position :

END

Element Configuration :

Single

Reverse Standoff Voltage :

9.9V

Factory Lead Time :

17 Weeks

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Voltage - Reverse Standoff (Typ) :

9.9V

ECCN Code :

EAR99

Number of Elements :

1

Power Dissipation-Max :

2W

Applications :

GENERAL PURPOSE

Published :

1997

Peak Pulse Power :

500W

Package / Case :

SQ-MELF, B

RoHS Status :

Non-RoHS Compliant

Peak Pulse Current :

27.5A

Current - Peak Pulse (10/1000μs) :

27.5A

Mounting Type :

Surface Mount

Direction :

Bidirectional

Clamping Voltage :

18.2V