10108777-10030TLF

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Mfr.Part #
10108777-10030TLF
Manufacturer
Amphenol Communications Solutions
Package / Case
Datasheet
Download
Description
CONN PCI EXP FMALE 36POS 0.039
Stock
10,219
In Stock :
10,219

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Manufacturer :
Amphenol Communications Solutions
Product Category :
Edgeboard Connectors
Packaging :
Tray
Contact Plating :
Gold
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Termination :
Solder, Staggered
Contact Material :
COPPER ALLOY
Feature :
Board Guide, Locking Ramp
Contact Finish Thickness :
30.0μin 0.76μm
Read Out :
Dual
Material - Insulation :
Polyamide (PA), Nylon, Glass Filled
Orientation :
Straight
Card Type :
PCI Express™
RoHS Status :
RoHS Compliant
Insulation Resistance :
1GOhm
Board Thickness :
1.56mm
Voltage - Rated AC :
300V
Pitch :
0.039 1.00mm
Number of Rows :
2
Color :
Black
Gender :
FEMALE
Contact Type :
Cantilever
Current Rating :
1.1A
Number of Positions :
36
Card Thickness :
0.062 1.57mm
Contact Finish :
Gold
Factory Lead Time :
11 Weeks
Mount :
Through Hole
Connector Type :
Cantilever
Housing Material :
Thermoplastic
Mounting Type :
Through Hole
Datasheets
10108777-10030TLF
Introducing Edgeboard Connectors Amphenol Communications Solutions 10108777-10030TLF from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, 10108777-10030TLF pinout, 10108777-10030TLF datasheet PDF, 10108777-10030TLF amp .Beyond Edgeboard Connectors Amphenol Communications Solutions 10108777-10030TLF ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.



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