10081530-11158ELF

Manufacturer :

Amphenol Communications Solutions

Product Category :

Inline Module Sockets

Number of Positions :

240

Terminal Pitch :

0.079mm

Mounting Type :

Through Hole

Standards :

MO-269

Contact Material :

COPPER ALLOY

RoHS Status :

RoHS Compliant

Published :

2014

Contact Finish Thickness :

30.0μin 0.76μm

Contact Resistance :

10MOhm

Insulation Material :

GLASS FILLED THERMOPLASTIC

Dielectric Withstanding Voltage :

500VAC V

Length - Termination :

0.105 inch

Insulation Resistance :

1000000Ohm

Number Of PCB Rows :

4

Total Number of Contacts :

240

Mount :

Through Hole

Connector Style :

RDIMM

Reliability :

COMMERCIAL

Contact Finish :

Gold

Termination Type :

Solder

JESD-609 Code :

e3

Plating Thickness :

30μin

Insulator Color :

Ivory

Body Breadth :

0.299 inch

Mounting Feature :

Normal, Standard - Top

Feature :

Board Lock, Latches

Operating Temperature (Min) :

-55°C

Number of Rows :

2

Durability :

25 Cycles

PCB Contact Row Spacing :

1.905 mm

Body Length or Diameter :

5.551 inch

Memory Type :

DDR3 SDRAM

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Number of Conductors :

ONE

Pbfree Code :

yes

Contact Style :

BELLOWED TYPE

Mating Contact Pitch :

0.039 inch

Factory Lead Time :

11 Weeks

Polarization Key :

POLARIZED HOUSING

Rated Current (Signal) :

0.75A

Body/Shell Style :

Receptacle

Reference Standard :

UL

Packaging :

Tray

Operating Temperature (Max) :

85°C

PCB Contact Pattern :

STAGGERED