XC7K70T-3FBG676E
- Mfr.Part #
- XC7K70T-3FBG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 300 I/O 676FCBGA
- Stock
- 990
- In Stock :
- 990
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Factory Lead Time :
- 10 Weeks
- Number of Pins :
- 676
- Terminal Pitch :
- 1mm
- Power Supplies :
- 11.83.3V
- Number of I/O :
- 300
- Number of Terminations :
- 676
- Speed Grade :
- -3
- Number of LABs/CLBs :
- 5125
- Base Part Number :
- XC7K70T
- Length :
- 27mm
- Published :
- 2010
- Combinatorial Delay of a CLB-Max :
- 0.58 ns
- ECCN Code :
- 3A991.D
- Number of Logic Elements/Cells :
- 65600
- HTS Code :
- 8542.39.00.01
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Qualification Status :
- Not Qualified
- Total RAM Bits :
- 4976640
- Number of Outputs :
- 300
- Package / Case :
- 676-BBGA, FCBGA
- Pin Count :
- 676
- Contact Plating :
- Copper, Silver, Tin
- Operating Temperature :
- 0°C~100°C TJ
- Number of Registers :
- 82000
- Voltage - Supply :
- 0.97V~1.03V
- Surface Mount :
- yes
- JESD-609 Code :
- e1
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Position :
- BOTTOM
- Width :
- 27mm
- Packaging :
- Tray
- RAM Size :
- 607.5kB
- Mounting Type :
- Surface Mount
- Series :
- Kintex®-7
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Clock Frequency :
- 1412MHz
- Terminal Form :
- Ball
- Height Seated (Max) :
- 2.54mm
- Supply Voltage :
- 1V
- Pbfree Code :
- yes
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- RoHS Status :
- ROHS3 Compliant
- Datasheets
- XC7K70T-3FBG676E
FPGAs AMD Xilinx XC7K70T-3FBG676E Overview
The AMD Xilinx XC7K70T-3FBG676E, part of the renowned Kintex-7 family, represents a highly capable FPGA (Field Programmable Gate Array) designed to meet the demanding requirements of modern high-speed and high-performance applications. This integrated circuit boasts a robust architecture that enables significant flexibility, making it an ideal choice for designers looking to balance performance and cost. The 676-pin FCBGA (Ball Grid Array) package facilitates dense board layouts while supporting a wide range of I/O options, enhancing its adaptability for various complex digital circuits.
XC7K70T-3FBG676E Features
This FPGA model offers an impressive array of features including 300 user I/Os, enabling extensive connectivity and interface options. Its programmable logic cells, combined with high-speed DSP slices, allow for optimized signal processing and complex algorithm implementations. The device also supports advanced serial connectivity with high data throughput, ensuring efficient communication in multi-component systems.
XC7K70T-3FBG676E Applications
- Communications Equipment: Utilized in routers, switches, and base stations where high data processing and throughput are necessary.
- Automotive Technology: Applied in driver assistance systems and infotainment units requiring rapid real-time processing and flexible interfacing capabilities.
- Industrial Automation: Helps in managing complex control systems, including robotics and process controllers that benefit from the FPGA's ability to reprogram functions and adapt to new algorithms.
- Consumer Electronics: Used in high-definition video processing units and gaming consoles where high-speed signal processing enhances user experience.
- Medical Devices: Integral to imaging systems like ultrasound and MRI machines, improving the precision and speed of medical diagnostics.
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