MXSMBJ15AE3

Manufacturer :

Microchip Technology

Product Category :

JESD-609 Code :

e3

Mounting Type :

Surface Mount

Package / Case :

DO-214AA, SMB

Peak Reflow Temperature (Cel) :

260

Voltage - Breakdown (Min) :

16.7V

Diode Element Material :

SILICON

Peak Pulse Power :

600W

Mount :

Surface Mount

Peak Pulse Current :

24A

Packaging :

Bulk

Type :

Zener

Max Reverse Leakage Current :

1μA

Test Current :

1mA

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

RoHS Status :

Non-RoHS Compliant

Element Configuration :

Single

Number of Elements :

1

Operating Temperature :

-65°C~150°C TJ

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Terminal Finish :

Matte Tin (Sn) - annealed

Published :

1997

Terminal Form :

C BEND

Number of Pins :

2

Power - Peak Pulse :

600W

Pbfree Code :

yes

Power Line Protection :

No

ECCN Code :

EAR99

Clamping Voltage :

24.4V

Number of Terminations :

2

Breakdown Voltage :

17.6V

Direction :

Unidirectional

Pin Count :

2

Reverse Standoff Voltage :

15V

Applications :

GENERAL PURPOSE

Series :

Military, MIL-PRF-19500

Time@Peak Reflow Temperature-Max (s) :

40

Unidirectional Channels :

1

Terminal Position :

Dual