MC9S12XEP768CAL

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

HTS Code :

8542.31.00.01

Data Converter :

A/D 16x12b

Width :

20mm

Package / Case :

112-LQFP

Height Seated (Max) :

1.6mm

RoHS Status :

ROHS3 Compliant

Program Memory Size :

768KB 768K x 8

JESD-30 Code :

S-PQFP-G112

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Oscillator Type :

External

Published :

2012

Terminal Position :

QUAD

DMA Channels :

No

Peripherals :

LVD, POR, PWM, WDT

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Peak Reflow Temperature (Cel) :

260

DAC Channels :

No

Core Size :

16-Bit

Has ADC :

yes

Time@Peak Reflow Temperature-Max (s) :

40

CPU Family :

CPU12

Base Part Number :

MC9S12XE768

Qualification Status :

Not Qualified

PWM Channels :

yes

Packaging :

Tray

ROM (words) :

786432

JESD-609 Code :

e3

Bit Size :

32

Speed :

50MHz

Program Memory Type :

Flash

Supply Voltage-Max (Vsup) :

1.98V

Terminal Pitch :

0.65mm

Number of Terminations :

112

Clock Frequency :

40MHz

Voltage - Supply (Vcc/Vdd) :

1.72V~5.5V

Operating Temperature :

-40°C~85°C TA

Supply Voltage-Min (Vsup) :

1.72V

Series :

HCS12X

Factory Lead Time :

16 Weeks

Number of I/O :

91

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Length :

20mm

Terminal Finish :

Matte Tin (Sn)

EEPROM Size :

4K x 8

RAM Size :

48K x 8

Terminal Form :

Gull wing

Supply Voltage :

1.8V

Mounting Type :

Surface Mount

Additional Feature :

IT ALSO REQUIRES 5 V I/O SUPPLY

Power Supplies :

3.3/5V

Surface Mount :

yes