LPC3154FET208,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Data Converter :

A/D 3x10b

ROM Programmability :

Flash

Clock Frequency :

25MHz

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Supply Voltage-Max (Vsup) :

1.3V

Package / Case :

208-TFBGA

Peripherals :

DMA, I2S, LCD, PWM, WDT

Voltage - Supply (Vcc/Vdd) :

1.1V~3.6V

ROM (words) :

0

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Series :

LPC3100

JESD-30 Code :

S-PBGA-B208

Has ADC :

yes

Height Seated (Max) :

1.15mm

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Operating Temperature :

-40°C~85°C TA

Terminal Position :

BOTTOM

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

DAC Channels :

yes

Published :

2009

Mounting Type :

Surface Mount

PWM Channels :

yes

Base Part Number :

LPC315*

Number of I/O :

10

RoHS Status :

ROHS3 Compliant

Terminal Pitch :

0.65mm

Number of Terminations :

208

Bit Size :

32

Oscillator Type :

External

RAM Size :

192K x 8

Packaging :

Tray

Program Memory Type :

ROMless

Core Size :

16/32-Bit

DMA Channels :

yes

Width :

12mm

Pin Count :

208

Core Processor :

ARM9®

Surface Mount :

yes

Supply Voltage-Min (Vsup) :

1.1V

Power Supplies :

1.21.8/3.3V

JESD-609 Code :

e1

Qualification Status :

Not Qualified

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Length :

12mm

Terminal Form :

Ball

Supply Voltage :

1.2V

Connectivity :

EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG

Speed :

180MHz