LPC2210FBD144/01K

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Mfr.Part #
LPC2210FBD144/01K
Manufacturer
NXP Semiconductors
Package / Case
144-LQFP
Datasheet
Download
Description
IC MCU 16/32BIT ROMLESS 144LQFP
Stock
4,182
In Stock :
4,182

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Brand :
NXP Semiconductors
Base Product Number :
LPC2210
PCB changed :
144
ECCN (US) :
EAR99
Product Type :
ARM Microcontrollers - MCU
Instruction Set Architecture :
RISC
Lead Shape :
Gull-wing
Maximum Operating Temperature (°C) :
85
Programmability :
No
UART :
0
Data Bus Width :
32 bit/16 bit
Mounting Type :
Surface Mount
Program Memory Size :
-
Series :
LPC2200
Supplier Package :
LQFP
Interface Type :
I2C/SPI
Package / Case :
144-LQFP
Program Memory Type :
ROMless
Manufacturer :
NXP
Mounting :
Surface Mount
Oscillator Type :
Internal
Mounting Style :
SMD/SMT
Maximum Clock Rate (MHz) :
60
Minimum Operating Temperature :
- 40 C
Device Core :
ARM7TDMI-S
Package Height :
1.45(Max)
I2C :
1
Supplier Device Package :
144-LQFP (20x20)
Number of I/O :
76
Maximum Operating Supply Voltage (V) :
1.95|3.6
RoHS :
Details
Operating Supply Voltage :
1.65 V to 1.95 V
Family Name :
LPC2000
Typical Operating Supply Voltage (V) :
1.8|3.3
Subcategory :
Microcontrollers - MCU
RoHS Status :
RoHS Compliant
Maximum Power Dissipation (mW) :
1500
Minimum Operating Temperature (°C) :
-40
Pin Count :
144
Operating Temperature :
-40°C ~ 85°C (TA)
Core Processor :
ARM7®
SPI :
2
No. of Timers :
2
Minimum Operating Supply Voltage (V) :
3|1.65|2.5
Supplier Temperature Grade :
Industrial
ADC Resolution (bit) :
10
RAM Size :
16kB
Data Bus Width (bit) :
16|32
I2S :
0
Core Architecture :
ARM
USB :
0
Package :
Bulk
Ethernet :
0
Voltage - Supply (Vcc/Vdd) :
1.65V ~ 3.6V
Packaging :
Tray
Connectivity :
EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Standard Package Name :
QFP
Package Length :
20.1(Max)
Product Category :
ARM Microcontrollers - MCU
Peripherals :
POR, PWM, WDT
Maximum CPU Frequency (MHz) :
60
Number of I/Os :
76 I/O
Speed :
75MHz
Core Size :
16/32-Bit
Data Converters :
A/D 8x10b
Maximum Operating Temperature :
+ 85 C
USART :
0
Product Status :
Active
Package Width :
20.1(Max)
HTS :
8542.31.00.01
EEPROM Size :
-
Number of ADCs :
Single
Datasheets
LPC2210FBD144/01K
Introducing Microcontrollers NXP Semiconductors LPC2210FBD144/01K from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:144-LQFP, Operating Temperature:-40°C ~ 85°C (TA), LPC2210FBD144/01K pinout, LPC2210FBD144/01K datasheet PDF, LPC2210FBD144/01K amp .Beyond Microcontrollers NXP Semiconductors LPC2210FBD144/01K ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC2210FBD144/01K


Microcontrollers NXP Semiconductors LPC2210FBD144/01K Overview

The Microcontrollers NXP Semiconductors LPC2210FBD144/01K is a versatile and powerful integrated circuit specifically engineered for demanding applications where efficiency and reliability are paramount. This robust microcontroller unit (MCU) from NXP Semiconductors seamlessly blends 16/32-bit processing capabilities with a ROMless configuration, offering exceptional flexibility and customization. It is housed in a 144-LQFP (Low-profile Quad Flat Package), ensuring compact integration into various electronic assemblies. This product is ideally suited for developers looking to design systems with specific memory and software requirements, offering a scalable platform for a wide range of industrial and commercial applications.

LPC2210FBD144/01K Features

This microcontroller provides a robust platform for sophisticated circuit designs, featuring a 16/32-bit ARM7TDMI-S core that delivers efficient processing and power management capabilities. The absence of onboard ROM encourages designers to implement their tailored memory solutions, making the LPC2210FBD144/01K highly adaptable to specific project needs. Its extensive I/O options and compatibility with a range of peripherals enhance its utility in complex electronic systems.

LPC2210FBD144/01K Applications

  • Industrial Automation: Integrates into control systems for sensors, actuators, and other automation components, enhancing process efficiency and reliability.
  • Medical Devices: Serves as the processing core in medical diagnostic equipment, offering reliable computation for critical health applications.
  • Automotive Applications: Utilized in vehicle management systems where precision and dependability are crucial for performance and safety.
  • Communication Systems: Forms the backbone of wired and wireless communication devices, ensuring robust data handling and transmission capabilities.
  • Consumer Electronics: Drives innovative consumer products, from gaming consoles to smart home devices, with its versatile processing power.
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