LFECP10E-3QN208C
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- Mfr.Part #
- LFECP10E-3QN208C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 208-BFQFP
- Datasheet
- Download
- Description
- IC FPGA 147 I/O 208QFP
- Stock
- 40,619
- In Stock ：
- 40,619
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Frequency :
- 340MHz
- Number of Logic Elements/Cells :
- 10200
- RAM Size :
- 34.5kB
- Number of Terminations :
- 208
- Reach Compliance Code :
- Unknown
- Pin Count :
- 208
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Qualification Status :
- Not Qualified
- Terminal Form :
- Gull wing
- Power Supplies :
- 1.21.2/3.33.3V
- Number of CLBs :
- 1280
- Packaging :
- Tray
- Terminal Finish :
- Matte Tin (Sn)
- Base Part Number :
- LFECP10
- Package / Case :
- 208-BFQFP
- Pbfree Code :
- yes
- Mounting Type :
- Surface Mount
- Total RAM Bits :
- 282624
- Number of Logic Blocks (LABs) :
- 1275
- Memory Size :
- 39.6kB
- Number of Pins :
- 208
- Voltage - Supply :
- 1.14V~1.26V
- Length :
- 28mm
- HTS Code :
- 8542.39.00.01
- Organization :
- 1280 CLBS
- Mount :
- Surface Mount
- Series :
- ECP
- ECCN Code :
- EAR99
- Lead Free :
- Lead Free
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Height Seated (Max) :
- 4.1mm
- Combinatorial Delay of a CLB-Max :
- 0.56 ns
- RoHS Status :
- RoHS Compliant
- Operating Supply Voltage :
- 1.2V
- Operating Temperature :
- 0°C~85°C TJ
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Published :
- 2000
- Supply Voltage :
- 1.2V
- JESD-609 Code :
- e3
- Terminal Pitch :
- 0.5mm
- Number of Outputs :
- 147
- Terminal Position :
- QUAD
- Width :
- 28mm
- Peak Reflow Temperature (Cel) :
- 245
- Number of I/O :
- 147
- Datasheets
- LFECP10E-3QN208C
1.2V V 4.1mm mm 39.6kB B FPGAs ECP Series 340MHz MHz 208-BFQFP 0.5mm mm 208
LFECP10E-3QN208C Overview
In the package 208-BFQFP, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 147 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 10200 logic elements/cells. Supply voltage is 1.2V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.14V~1.26V, this device operates with ease. This is a type of FPGA that is part of the ECP series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, 147 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 208. Fpga electronics is worth mentioning that this device provides 282624 bfpga electronics s of RAM. LFECP10 is the base part number that can be used to identify related parts. The RAM si34.5kBe of this FPGA module reaches 34.5kB so as to guarantee the normal operation of the program during operation. The device has 208 pins which are included in the design. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. This is a battery operated device that operates on 1.21.2/3.33.3V. I am going to present you with a device that is equipped with 208 pins. 1275 logic blocks (LABs) constitute its basic building block. There is a memory of 39.6kB embedded inside this FPGA module that can be used to store programs and data. The architecture of the system is based on 1280 CLBs. The system operates at a frequency of 340MHz in order to achieve maximum efficiency.
LFECP10E-3QN208C Features
147 I/Os
Up to 282624 RAM bits
208 LABs/CLBs
1275 logic blocks (LABs)
Operating from a frequency of 340MHz
LFECP10E-3QN208C Applications
There are a lot of Lattice Semiconductor Corporation
LFECP10E-3QN208C FPGAs applications.
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics
- Distributed Monetary Systems
- Data Center
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