IS61LF102418A-7.5B3I

Manufacturer :

Integrated Silicon Solution, Inc. (ISSI)

Product Category :

Memory

Height Seated (Max) :

1.2mm

ECCN Code :

3A991.B.2.A

Operating Temperature :

-40°C~85°C TA

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Memory Interface :

Parallel

Memory Size :

18Mb 1M x 18

Memory Type :

Volatile

Terminal Pitch :

1mm

Packaging :

Tray

Pbfree Code :

No

Length :

15mm

Number of Terminations :

165

Pin Count :

165

Memory Density :

18874368 bit

Voltage - Supply :

3.135V~3.465V

Supply Voltage-Min (Vsup) :

3.135V

I/O Type :

COMMON

JESD-609 Code :

e0

Organization :

1MX18

Access Time :

7.5ns

Supply Voltage-Max (Vsup) :

3.465V

Number of Functions :

1

Terminal Position :

BOTTOM

Terminal Finish :

Tin/Lead (Sn/Pb)

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Memory Format :

SRAM

Standby Voltage-Min :

3.14V

Qualification Status :

Not Qualified

Clock Frequency :

117MHz

RoHS Status :

ROHS3 Compliant

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

HTS Code :

8542.32.00.41

Memory Width :

18

Supply Voltage :

3.3V

Number of Pins :

165

Mounting Type :

Surface Mount

Output Characteristics :

3-STATE

Supply Current-Max :

0.25mA

Surface Mount :

yes

Standby Current-Max :

0.075A

Power Supplies :

2.5/3.33.3V

Additional Feature :

PIPELINED ARCHITECTURE, FLOW-THROUGH

Package / Case :

165-TBGA

Width :

13mm