EP3C25F256C7ES

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Mfr.Part #
EP3C25F256C7ES
Manufacturer
Altera (Intel)
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 156 I/O 256FBGA
Stock
1,439
In Stock :
1,439

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Mounting Type :
Surface Mount
ECCN Code :
3A991
Height Seated (Max) :
1.55mm
Clock Frequency :
472.5MHz
HTS Code :
8542.39.00.01
Terminal Finish :
TIN LEAD
Base Part Number :
EP3C25
Reach Compliance Code :
Compliant
Series :
Cyclone® III
Total RAM Bits :
608256
Number of I/O :
156
JESD-609 Code :
e0
Surface Mount :
yes
Packaging :
Tray
JESD-30 Code :
R-PBGA-B256
Supply Voltage :
1.2V
Number of Logic Elements/Cells :
24624
Terminal Position :
BOTTOM
Operating Temperature :
0°C~85°C TJ
Number of LABs/CLBs :
1539
Package / Case :
256-LBGA
Width :
17mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Length :
17mm
Terminal Pitch :
1mm
Number of Terminations :
256
Qualification Status :
Not Qualified
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
1.15V~1.25V
Datasheets
EP3C25F256C7ES
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3C25F256C7ES from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:EP3C25, Operating Temperature:0°C~85°C TJ, Package / Case:256-LBGA, Number of Terminations:256, EP3C25F256C7ES pinout, EP3C25F256C7ES datasheet PDF, EP3C25F256C7ES amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3C25F256C7ES ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3C25F256C7ES


FPGAs Altera (Intel) EP3C25F256C7ES Overview

The FPGAs Altera (Intel) EP3C25F256C7ES represents a state-of-the-art integrated circuit designed to meet the demanding requirements of modern electronic devices. Manufactured by Altera, now part of Intel, this IC FPGA offers a perfect blend of power, flexibility, and cost-effectiveness. Featuring a 256-ball fine-pitch BGA package, it integrates seamlessly into a variety of system architectures, facilitating sophisticated digital logic functions while maintaining a low power footprint. The robust configuration of this product makes it ideal for designers aiming to accelerate time-to-market with reliable and scalable solutions.

EP3C25F256C7ES Features

This FPGA device includes 156 programmable I/O ports, which are essential for extensive interfacing in complex applications. The high-density nature of the 256FBGA package allows for a compact footprint on PCBs, making it suitable for space-constrained applications while providing sufficient capability for high-performance operations.

EP3C25F256C7ES Applications

  • Consumer Electronics: In devices such as smartphones and tablets, the EP3C25F256C7ES manages multiple functions including signal processing and power management, optimizing performance and battery life.
  • Industrial Automation: Applied in control systems, this FPGA can process inputs from various sensors and outputs to actuators, ensuring efficient and reliable machinery operation.
  • Automotive Systems: Supports advanced driver-assistance systems (ADAS) by handling real-time data processing tasks, enhancing vehicle safety and performance.
  • Telecommunications: Utilized in network equipment, where high-speed signal processing is critical for managing data flow across communications infrastructures.
  • Medical Devices: Key in medical imaging systems, where it processes complex algorithms necessary for high-resolution imaging technologies.
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